Advantages
- Higher Technology: 6 nm (6 nm vs 10 nm)
- Newer Launch Date: April 2024 (April 2024 vs December 2017)
- Higher Frequency: 2800 MHz (2500 MHz vs 2800 MHz)
Basic
MediaTek
Label Name
Qualcomm
April 2024
Launch Date
December 2017
SmartPhone Mid range
Platform
SmartPhone Flagship
TSMC
Manufacturing
Samsung
Dimensity 7025
Model Name
SDM845
2x 2.5 GHz – Cortex-A78
6x 2 GHz – Cortex-A55
6x 2 GHz – Cortex-A55
Architecture
4x 2.8 GHz – Kryo 385 Gold (Cortex-A75)
4x 1.8 GHz – Kryo 385 Silver (Cortex-A55)
4x 1.8 GHz – Kryo 385 Silver (Cortex-A55)
8
Cores
8
6 nm
Technology
10 nm
2500 MHz
Frequency
2800 MHz
10
Transistor count
3
GPU Specifications
IMG BXM-8-256
GPU name
Adreno 630
950 MHz
GPU frequency
710 MHz
-
FLOPS
0.727 TFLOPS
18
Shading units
256
8
Execution units
2
3.0
OpenCL version
2.0
1.3
Vulkan version
1.1
2520 x 1080
Max display resolution
3840 x 2160
-
DirectX version
12.1
Connectivity
LTE Cat. 18
4G support
LTE Cat. 18
Yes
5G support
No
5.3
Bluetooth
5.0
5
Wi-Fi
5
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS
Memory Specifications
LPDDR5
Memory type
LPDDR4X
3200 MHz
Memory frequency
1866 MHz
4x 16 Bit
Memory Bus
2x 32 Bit
Miscellaneous
Yes
Neural processor (NPU)
Hexagon 685
-
L2 Cache
256 KB
AIFF, CAF, MP3, MP4, WAV
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
1x 200MP
Max camera resolution
1x 192MP
UFS 2.2, UFS 3.1
Storage type
UFS 2.1
2K at 30FPS
Video capture
4K at 60FPS
H.264, H.265, VP9
Video codecs
H.264, H.265, VP9
2K at 30FPS
Video playback
4K at 60FPS
-
TDP
9 W
ARMv8.2-A
Instruction set
ARMv8.2-A
Benchmarks
Geekbench 6 Single Core
Dimensity 7025
1004
+77%
Snapdragon 845
566
Geekbench 6 Multi Core
Dimensity 7025
2521
+21%
Snapdragon 845
2075
AnTuTu 10
Dimensity 7025
485165
+6%
Snapdragon 845
457459
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