MediaTek Dimensity 7025
vs
HiSilicon Kirin 980

vs

SoC Comparison Result

Below are the results of a comparison of MediaTek Dimensity 7025 and HiSilicon Kirin 980 mobile processors based on key performance characteristics, as well as power consumption and much more.

Advantages

  • Higher Technology: 6 nm (6 nm vs 7 nm)
  • Newer Launch Date: April 2024 (April 2024 vs August 2018)
  • Higher Frequency: 2600 MHz (2500 MHz vs 2600 MHz)

Basic

MediaTek
Label Name
HiSilicon
April 2024
Launch Date
August 2018
SmartPhone Mid range
Platform
SmartPhone Flagship
TSMC
Manufacturing
TSMC
Dimensity 7025
Model Name
Kirin 980
2x 2.5 GHz – Cortex-A78
6x 2 GHz – Cortex-A55
Architecture
2x 2.6 GHz – Cortex-A76
2x 1.92 GHz – Cortex-A76
4x 1.8 GHz – Cortex-A55
8
Cores
8
6 nm
Technology
7 nm
2500 MHz
Frequency
2600 MHz
10
Transistor count
6.9

GPU Specifications

IMG BXM-8-256
GPU name
Mali-G76 MP10
950 MHz
GPU frequency
720 MHz
-
FLOPS
0.5184 TFLOPS
18
Shading units
36
8
Execution units
10
3.0
OpenCL version
2.0
1.3
Vulkan version
1.3
2520 x 1080
Max display resolution
3120 x 1440
-
DirectX version
12

Connectivity

Up to 2770 Mbps
Download speed
Up to 1400 Mbps
LTE Cat. 18
4G support
LTE Cat. 21
Yes
5G support
No
5.3
Bluetooth
5.0
5
Wi-Fi
6
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo

Memory Specifications

LPDDR5
Memory type
LPDDR4X
3200 MHz
Memory frequency
2133 MHz
4x 16 Bit
Memory Bus
4x 16 Bit

Miscellaneous

-
L2 Cache
4 MB
AIFF, CAF, MP3, MP4, WAV
Audio codecs
AIFF, CAF, MP3, MP4, WAV
1x 200MP
Max camera resolution
1x 48MP, 2x 20MP
UFS 2.2, UFS 3.1
Storage type
UFS 2.1, UFS 3.0
2K at 30FPS
Video capture
4K at 30FPS
H.264, H.265, VP9
Video codecs
H.264, H.265, VP9
2K at 30FPS
Video playback
4K at 30FPS
-
TDP
6 W
ARMv8.2-A
Instruction set
ARMv8.2-A
Yes
Neural processor (NPU)
Yes

Benchmarks

Geekbench 6 Single Core
Dimensity 7025
1004 +20%
Kirin 980
835
Geekbench 6 Multi Core
Dimensity 7025
2521 +18%
Kirin 980
2132
AnTuTu 10
Dimensity 7025
485165
Kirin 980
595078 +23%