Advantages
- Higher Technology: 6 nm (6 nm vs 7 nm)
- Higher Frequency: 2500 MHz (2500 MHz vs 2285 MHz)
- Newer Launch Date: May 2025 (April 2024 vs May 2025)
Basic
MediaTek
Label Name
HiSilicon
April 2024
Launch Date
May 2025
SmartPhone Mid range
Platform
SmartPhone Mid range
TSMC
Manufacturing
SMIC
Dimensity 7025
Model Name
Kirin 8020
2x 2.5 GHz – Cortex-A78
6x 2 GHz – Cortex-A55
6x 2 GHz – Cortex-A55
Architecture
1x 2.285 GHz, 3x 2.05 GHz, 4x 1.3 GHz
8
Cores
8
6 nm
Technology
7 nm
2500 MHz
Frequency
2285 MHz
10
Transistor count
-
GPU Specifications
IMG BXM-8-256
GPU name
Maleoon 920
950 MHz
GPU frequency
840 MHz
-
FLOPS
1.7203 TFLOPS
18
Shading units
512
8
Execution units
-
3.0
OpenCL version
2.0
1.3
Vulkan version
1.3
2520 x 1080
Max display resolution
-
-
DirectX version
12
Connectivity
Up to 2770 Mbps
Download speed
-
LTE Cat. 18
4G support
-
Yes
5G support
Yes
5.3
Bluetooth
5.4
5
Wi-Fi
7
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Memory Specifications
LPDDR5
Memory type
LPDDR5X
3200 MHz
Memory frequency
4266 MHz
4x 16 Bit
Memory Bus
4x 16 Bit
Miscellaneous
AIFF, CAF, MP3, MP4, WAV
Audio codecs
- AAC
- AIFF
- CAF
- MP3
- MP4
- WAV
- AIFF
- CAF
- MP3
- MP4
- WAV
1x 200MP
Max camera resolution
-
UFS 2.2, UFS 3.1
Storage type
UFS 4.0
2K at 30FPS
Video capture
4K at 60FPS, 1K at 120FPS
H.264, H.265, VP9
Video codecs
- H.264
- H.265
- VP9
- H.265
- VP9
2K at 30FPS
Video playback
4K at 60FPS, 1080p at 120FPS
ARMv8.2-A
Instruction set
ARMv8-A
Yes
Neural processor (NPU)
Da Vinci
Benchmarks
Geekbench 6 Single Core
Dimensity 7025
1004
Kirin 8020
1377
+37%
Geekbench 6 Multi Core
Dimensity 7025
2521
Kirin 8020
3499
+39%
AnTuTu 10
Dimensity 7025
485165
Kirin 8020
988298
+104%
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