HiSilicon Kirin 9010s
vs
HiSilicon Kirin 710F
vs
SoC Comparison Result
Below are the results of a comparison of
HiSilicon Kirin 9010s
and
HiSilicon Kirin 710F
mobile processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Higher Technology: 7 nm (7 nm vs 12 nm)
- Newer Launch Date: July 2025 (July 2025 vs January 2019)
Basic
HiSilicon
Label Name
HiSilicon
July 2025
Launch Date
January 2019
SmartPhone Flagship
Platform
SmartPhone Mid range
-
Manufacturing
TSMC
Kirin 9010s
Model Name
Kirin 710F
2 cores x 2.5GHz + 6 cores x 2.05GHz + 4 cores x 1.50GHz
Architecture
4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
4x 1.7 GHz – Cortex-A53
12
Cores
8
7 nm
Technology
12 nm
-
Frequency
2200 MHz
-
Transistor count
5.5
GPU Specifications
-
GPU name
Mali-G51 MP4
-
GPU frequency
1000 MHz
-
FLOPS
0.128 TFLOPS
-
Shading units
16
-
Execution units
4
-
OpenCL version
2.0
-
Vulkan version
1.3
-
Max display resolution
2340 x 1080
-
DirectX version
12
Connectivity
-
Download speed
Up to 600 Mbps
Yes
4G support
LTE Cat. 12
-
5G support
No
Bluetooth 5.2, поддержка BLE, SBC, AAC, LDAC и L2HC.
Bluetooth
4.2
802.11a/b/g/n/ac/ax/be, 2 × 2 MIMO, EHT160
Wi-Fi
4
-
Navigation
GPS, GLONASS, Beidou, Galileo
Memory Specifications
-
Memory type
LPDDR4X
-
Memory frequency
1866 MHz
-
Memory Bus
2x 32 Bit
Miscellaneous
-
L2 Cache
512 KB
-
Audio codecs
AIFF, CAF, MP3, MP4, WAV
-
Max camera resolution
1x 48MP, 2x 24MP
-
Storage type
eMMC 5.1, UFS 2.1
-
Video capture
1K at 30FPS
-
Video codecs
H.264, H.265, VP8, VP9
-
Video playback
1080p at 60FPS
-
TDP
5 W
-
Instruction set
ARMv8-A
-
Neural processor (NPU)
No
Benchmarks
Geekbench 6 Single Core
Kirin 9010s
1442
+306%
Kirin 710F
355
Geekbench 6 Multi Core
Kirin 9010s
4443
+254%
Kirin 710F
1255
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