HiSilicon Kirin 9010 vs MediaTek Dimensity 8300
SoC Comparison Result
Below are the results of a comparison of
HiSilicon Kirin 9010
and
MediaTek Dimensity 8300
mobile processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Newer Launch Date: April 2024 (April 2024 vs November 2023)
- Higher Technology: 4 nm (7 nm vs 4 nm)
- Higher Frequency: 3350 MHz (2300 MHz vs 3350 MHz)
Basic
HiSilicon
Label Name
MediaTek
April 2024
Launch Date
November 2023
SmartPhone Flagship
Platform
SmartPhone Flagship
SMIC
Manufacturing
TSMC
Kirin 9010
Model Name
Dimensity 8300
2x 2.3 GHz – TaiShan V121 4x 1.55 GHz – TaiShan V1216x 2.18 GHz – Cortex-A510
Architecture
1x 3.35 GHz – Cortex-A715
3x 3.2 GHz – Cortex-A715
4x 2.2 GHz – Cortex-A510
12
Cores
8
7 nm
Technology
4 nm
2300 MHz
Frequency
3350 MHz
GPU Specifications
Maleoon 910
GPU name
Mali-G615 MP6
750 MHz
GPU frequency
1400 MHz
-
Execution units
6
-
OpenCL version
2.0
-
Vulkan version
1.3
-
Max display resolution
2960 x 1440
Connectivity
-
5G support
Yes
-
Bluetooth
5.4
-
Wi-Fi
6
-
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Memory Specifications
-
Memory type
LPDDR5X
2750 MHz
Memory frequency
4266 MHz
4x 16 Bit
Memory Bus
4x 16 Bit
Miscellaneous
-
Neural processor (NPU)
MediaTek APU 780
-
Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
-
Max camera resolution
1x 320MP
-
Storage type
UFS 4.0
-
Video capture
4K at 60FPS
-
Video codecs
H.264, H.265, AV1, VP9
-
Video playback
4K at 60FPS
-
Instruction set
ARMv9-A
Benchmarks
Geekbench 6 Single Core
Kirin 9010
1413
Dimensity 8300
1506
+7%
Geekbench 6 Multi Core
Kirin 9010
4560
Dimensity 8300
4844
+6%
AnTuTu 10
Kirin 9010
959921
Dimensity 8300
1518170
+58%
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