HiSilicon Kirin 9010 vs MediaTek Dimensity 8200
SoC Comparison Result
Below are the results of a comparison of HiSilicon Kirin 9010 and MediaTek Dimensity 8200 mobile processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Newer Launch Date: April 2024 (April 2024 vs December 2022)
- Higher Technology: 4 nm (7 nm vs 4 nm)
- Higher Frequency: 3100 MHz (2300 MHz vs 3100 MHz)
- Higher Max Bandwidth: 51.2 Gbit/s (44 Gbit/s vs 51.2 Gbit/s)
Basic
HiSilicon
Label Name
MediaTek
April 2024
Launch Date
December 2022
SmartPhone Flagship
Platform
SmartPhone Flagship
SMIC
Manufacturing
TSMC
Kirin 9010
Model Name
MT6896Z
2x 2.3 GHz – TaiShan V1214x 1.55 GHz – TaiShan V1216x 2.18 GHz – Cortex-A510
Architecture
1x 3.1 GHz – Cortex A78
3x 3 GHz – Cortex A78
4x 2 GHz – Cortex A55
12
Cores
8
7 nm
Technology
4 nm
2300 MHz
Frequency
3100 MHz
GPU Specifications
Maleoon 910
GPU name
Mali-G610 MP6
750 MHz
GPU frequency
950 MHz
-
FLOPS
1.442 TFLOPS
-
Execution units
6
-
OpenCL version
2.0
-
Vulkan version
1.3
-
Max display resolution
2960 x 1440
Connectivity
-
4G support
LTE Cat. 21
-
5G support
Yes
-
Bluetooth
5.3
-
Wi-Fi
6
-
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Memory Specifications
-
Memory type
LPDDR5
2750 MHz
Memory frequency
3200 MHz
4x 16 Bit
Memory Bus
4x 16 Bit
44 Gbit/s
Max Bandwidth
51.2 Gbit/s
Miscellaneous
-
Neural processor (NPU)
MediaTek APU 580
-
Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
-
Max camera resolution
1x 320MP
-
Storage type
UFS 3.1
-
Video capture
4K at 60FPS
-
Video codecs
H.264, H.265, AV1, VP9
-
Video playback
4K at 60FPS
-
TDP
6 W
-
Instruction set
ARMv8.2-A
Benchmarks
Geekbench 6 Single Core
Kirin 9010
1413
+15%
Dimensity 8200
1229
Geekbench 6 Multi Core
Kirin 9010
4560
+17%
Dimensity 8200
3892
AnTuTu 10
Kirin 9010
959921
+5%
Dimensity 8200
915634
