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MediaTek Dimensity 6360

vs

Qualcomm Snapdragon 7s Gen 3

SoC Comparison Result

Below are the results of a comparison of MediaTek Dimensity 6360 and Qualcomm Snapdragon 7s Gen 3 mobile processors based on key performance characteristics, as well as power consumption and much more.

Advantages

MediaTek Dimensity 6360

Newer Launch Date: May 2026 (May 2026 vs August 2024)

Qualcomm Snapdragon 7s Gen 3

Higher Technology: 4 nm (6 nm vs 4 nm)
Higher Frequency: 2500 MHz (Up to 2.4GHz vs 2500 MHz)

Basic

MediaTek

Label Name

Qualcomm

May 2026

Launch Date

August 2024

SmartPhone Mid range

Platform

SmartPhone Mid range

Manufacturing

TSMC

MediaTek Dimensity 6360

Model Name

SM7635

2x Arm Cortex-A76 @ 2.4GHz + 6x Arm Cortex-A55 @ 2.0GHz

Architecture

1x 2.5 GHz – Kryo Prime
3x 2.4 GHz – Kryo Gold
4x 1.8 GHz – Kryo Silver

Octa (8)

Cores

6 nm

Technology

4 nm

Up to 2.4GHz

Frequency

2500 MHz

GPU Specifications

Arm Mali-G57 MC2

GPU name

2520 x 1080

Max display resolution

3360 x 1600

Connectivity

SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD Band, NR FDD Band, DSS, NR DL 2CC, 140 MHz bandwidth, 256QAM NR UL 2CC, 256QAM VoNR, Dual VoNR, Dual 5G SIM, EPS fallback

Cellular specific functions

2G / 3G / 4G / 5G Multi-Mode, 4G Carrier Aggregation (CA), 5G Carrier Aggregation (CA), EDGE, 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA

Cellular technologies

NR DL 2CC, 140 MHz bandwidth, 8-layer DL MIMO

Downlink functions

3.3Gbps

Download speed

Up to 2900 Mbps

MediaTek 5G UltraSave 3.0+

Modem power saving technologies

256QAM NR UL 2CC

Uplink functions