Advantages
- Higher Technology: 3 nm (3 nm vs 7 nm)
- Newer Launch Date: August 2025 (August 2025 vs July 2025)
Basic
Google
Label Name
HiSilicon
August 2025
Launch Date
July 2025
SmartPhone Flagship
Platform
SmartPhone Flagship
TSMC
Manufacturing
-
Tensor G5
Model Name
Kirin 9010s
1x 3.4 GHz – Cortex-X4
5x 2.85 GHz – Cortex-A725
2x 2.4 GHz – Cortex-A525
5x 2.85 GHz – Cortex-A725
2x 2.4 GHz – Cortex-A525
Architecture
2 cores x 2.5GHz + 6 cores x 2.05GHz + 4 cores x 1.50GHz
8
Cores
12
3 nm
Technology
7 nm
3400 MHz
Frequency
-
GPU Specifications
1100 MHz
GPU frequency
-
1.536 TFLOPS
FLOPS
-
3840 x 2400
Max display resolution
-
Connectivity
-
4G support
Yes
Yes
5G support
-
5.4
Bluetooth
Bluetooth 5.2, поддержка BLE, SBC, AAC, LDAC и L2HC.
7
Wi-Fi
802.11a/b/g/n/ac/ax/be, 2 × 2 MIMO, EHT160
GPS, GLONASS, Beidou, Galileo, QZSS
Navigation
-
Memory Specifications
LPDDR5X
Memory type
-
4x 16 Bit
Memory Bus
-
Miscellaneous
- AAC
- AIFF
- CAF
- MP3
- MP4
- WAV
- AIFF
- CAF
- MP3
- MP4
- WAV
Audio codecs
-
1x 200MP
Max camera resolution
-
UFS 3.1, UFS 4.0
Storage type
-
8K at 30FPS, 4K at 120FPS
Video capture
-
- H.264
- H.265
- AV1
- VP9
- H.265
- AV1
- VP9
Video codecs
-
8K at 30FPS, 4K at 120FPS
Video playback
-
ARMv9.2-A
Instruction set
-
Yes
Neural processor (NPU)
-
Benchmarks
Geekbench 6 Single Core
Tensor G5
2222
+54%
Kirin 9010s
1442
Geekbench 6 Multi Core
Tensor G5
5598
+26%
Kirin 9010s
4443
AntuTu 11
Tensor G5
1549798
+20%
Kirin 9010s
1286775
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