Advantages
- Higher Technology: TSMC 4nm FinFET (TSMC 4nm FinFET vs 7 nm)
- Newer Launch Date: January 2026 (January 2026 vs December 2023)
- More Total Cores: 12 (4 vs 12)
- Larger L3 Cache: 12 MB (8 MB vs 12 MB)
Basic
AMD
Label Name
Intel
January 2026
Launch Date
December 2023
Laptop
Platform
Laptop
Ryzen AI 5 430
Model Name
Core Ultra 5 135U
Gorgon Point
Code Name
Meteor Lake
-
Foundry
Intel
1x Zen 5, 3x Zen 5c
Generation
Ultra 5 (Meteor Lake)
Windows 11 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit
OS Support
-
CPU Specifications
4
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
12
8
Total Threads
14
-
Performance-cores
2
-
Efficient-cores
10
2 GHz
Basic Frequency
-
Up to 4.5 GHz
Max Turbo Frequency
-
-
Performance-core Base Frequency
1.6 GHz
-
Efficient-core Base Frequency
1.1 GHz
-
Efficient-core Max Turbo Frequency
3.6 GHz
-
Performance-core Max Turbo Frequency
4.4 GHz
-
L1 Cache
112 KB per core
4 MB
L2 Cache
2 MB per core
8 MB
L3 Cache
12 MB
-
Bus Frequency
100MHz
FP8
CPU Socket
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
Intel BGA 2049
-
Multiplier
36.0
-
Unlocked Multiplier
No
TSMC 4nm FinFET
Technology
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
7 nm
28W
TDP
15 W
100°C
Max. Operating Temperature
Junction Temperature is the maximum temperature allowed at the processor die.
-
PCIe® 4.0
PCI Express Version
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
-
-
PCIe Version
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
4.0
Memory Specifications
DDR5 (FP8), LPDDR5X (FP8)
Memory Type
DDR5-5600,LPDDR5x-7467
256 GB
Max Memory Size
Max memory size refers to the maximum memory capacity supported by the processor.
96GB
2
Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
2
4x2R LPDDR5x-8000, DDR5-5600
Maximum Memory Speed
-
No
ECC Memory Support
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
No
GPU Specifications
AMD Radeon™ 840M
Integrated Graphics Model
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
Intel® Graphics
-
GPU Max Dynamic Frequency
1900 MHz
4
Graphics Core Count
-
2800 MHz
Graphics Frequency
-
-
Execution Units
4
Interfaces and Ports
-
PCIe Lanes
20
Miscellaneous
Benchmarks
Geekbench 6 Single Core
Ryzen AI 5 430
2214
+36%
Core Ultra 5 135U
1632
Geekbench 6 Multi Core
Ryzen AI 5 430
6942
+1%
Core Ultra 5 135U
6868
Geekbench 7 Single Core
Ryzen AI 5 430
2192
+27%
Core Ultra 5 135U
1726
Geekbench 7 Multi Core
Ryzen AI 5 430
7079
Core Ultra 5 135U
7668
+8%
Passmark CPU Single Core
Ryzen AI 5 430
3877
+10%
Core Ultra 5 135U
3536
Passmark CPU Multi Core
Ryzen AI 5 430
13958
Core Ultra 5 135U
19254
+38%
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