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AMD Athlon 200GE

vs

Intel Xeon E5-2650 v2

CPU Comparison Result

Below are the results of a comparison of AMD Athlon 200GE and Intel Xeon E5-2650 v2 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Athlon 200GE

Higher Technology: 14nm (14nm vs 22 nm)
Newer Launch Date: September 2018 (September 2018 vs September 2013)

Intel Xeon E5-2650 v2

More Total Cores: 8 (2 vs 8)
Larger L3 Cache: 20MB shared (4MB vs 20MB shared)

Basic

AMD

Label Name

Intel

September 2018

Launch Date

September 2013

Desktop

Platform

Server

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Xeon E5-2650 v2

Raven Ridge

Code Name

Ivy Bridge-EP

Foundry

Intel

Generation

Xeon E5 (Ivy Bridge-EP)

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

3.2GHz

Basic Frequency

Performance-core Base Frequency

2.6 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

3.4 GHz

192KB

L1 Cache

64K per core

1MB

L2 Cache

256K per core

4MB

L3 Cache

20MB shared

AM4

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

Intel Socket 2011

Unlocked Multiplier

Multiplier

26.0

Bus Frequency

100MHz

Unlocked for Overclocking

AMD`s product warranty does not cover damages caused by overclocking, even when overclocking is enabled via AMD hardware and/or software. GD-26.

14nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

22 nm

35W

TDP

95 W

95°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

PCIe® 3.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Transistor Count

1.4 billions

Memory Specifications

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR3

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Up to 2667MT/s

Bus Speed

ECC Memory Support

Yes

GPU Specifications

Radeon™ Vega 3 Graphics

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

1000 MHz

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

Graphics Core Count