MediaTek Dimensity 8350
vs
Qualcomm Snapdragon 665
vs
SoC Comparison Result
Below are the results of a comparison of
MediaTek Dimensity 8350
and
Qualcomm Snapdragon 665
mobile processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Higher Technology: 4 nm (4 nm vs 11 nm)
- Higher Frequency: 3350 MHz (3350 MHz vs 2000 MHz)
- Newer Launch Date: November 2024 (November 2024 vs April 2019)
Basic
MediaTek
Label Name
Qualcomm
November 2024
Launch Date
April 2019
SmartPhone Mid range
Platform
SmartPhone Mid range
TSMC
Manufacturing
Samsung
MT6897 MT6897Z_A/ZA MT8792Z/NA
Model Name
SM6125
1x 3.35 GHz – Cortex-A715, 3x 3.2 GHz – Cortex-A715, 4x 2.2 GHz – Cortex-A510
Architecture
4x 2 GHz – Kryo 260 Gold (Cortex-A73)
4x 1.8 GHz – Kryo 260 Silver (Cortex-A53)
4x 1.8 GHz – Kryo 260 Silver (Cortex-A53)
8
Cores
8
4 nm
Technology
11 nm
3350 MHz
Frequency
2000 MHz
-
Transistor count
1.75
GPU Specifications
Mali-G615 MP6
GPU name
Adreno 610
1400 MHz
GPU frequency
950 MHz
2.1504 TFLOPS
FLOPS
0.2432 TFLOPS
128
Shading units
128
-
Execution units
1
2.0
OpenCL version
2.0
1.3
Vulkan version
1.1
2960 x 1440
Max display resolution
2520 x 1080
-
DirectX version
12.1
Connectivity
Up to 5170 Mbps
Download speed
Up to 600 Mbps
LTE Cat. 24
4G support
LTE Cat. 13
Yes
5G support
No
5.4
Bluetooth
5.0
6
Wi-Fi
5
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS
Memory Specifications
LPDDR5X
Memory type
LPDDR4X
4266 MHz
Memory frequency
1866 MHz
4x 16 Bit
Memory Bus
2x 16 Bit
Miscellaneous
-
L2 Cache
1 MB
4 MB
L3 cache
-
- AAC LC
- FLAC
- HE-AACv1
- HE-AACv2
- MP3
- FLAC
- HE-AACv1
- HE-AACv2
- MP3
Audio codecs
AIFF, CAF, MP3, MP4, WAV
1x 320MP
Max camera resolution
1x 48MP, 2x 16MP
UFS 4.0
Storage type
eMMC 5.1, UFS 2.1
4K at 60FPS
Video capture
4K at 30FPS
- H.264
- H.265
- AV1
- VP9
- H.265
- AV1
- VP9
Video codecs
H.264, H.265, VP8, VP9
4K at 60FPS
Video playback
4K at 30FPS
-
TDP
5 W
ARMv9-A
Instruction set
ARMv8-A
MediaTek APU 780
Neural processor (NPU)
Hexagon 686
Benchmarks
Geekbench 6 Single Core
Dimensity 8350
1298
+285%
Snapdragon 665
337
Geekbench 6 Multi Core
Dimensity 8350
4368
+274%
Snapdragon 665
1167
FP32 (float)
Dimensity 8350
2172
+813%
Snapdragon 665
238
AnTuTu 10
Dimensity 8350
1417030
+514%
Snapdragon 665
230895
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