Home / SoC Comparison / MediaTek Dimensity 7300e or Qualcomm Snapdragon 7 Gen 3: What's better?

MediaTek Dimensity 7300e

vs

Qualcomm Snapdragon 7 Gen 3

SoC Comparison Result

Below are the results of a comparison of MediaTek Dimensity 7300e and Qualcomm Snapdragon 7 Gen 3 mobile processors based on key performance characteristics, as well as power consumption and much more.

Advantages

MediaTek Dimensity 7300e

Newer Launch Date: April 2026 (April 2026 vs November 2023)

Qualcomm Snapdragon 7 Gen 3

Higher Technology: 4 nm (6 nm vs 4 nm)
Higher Frequency: 2630 MHz (Up to 2.5GHz vs 2630 MHz)

Basic

MediaTek

Label Name

Qualcomm

April 2026

Launch Date

November 2023

SmartPhone Mid range

Platform

SmartPhone Mid range

Manufacturing

TSMC

MediaTek Dimensity 7300e

Model Name

SM7550-AB

4x Arm Cortex-A78 @ 2.5GHz + 4x Arm Cortex-A55 @ 2.0GHz

Architecture

1x 2.63 GHz – Cortex-A715
3x 2.4 GHz – Cortex-A715
4x 1.8 GHz – Cortex-A510

Octa (8)

Cores

6 nm

Technology

4 nm

Up to 2.5GHz

Frequency

2630 MHz

GPU Specifications

Arm Mali-G610 MC2

GPU name

Adreno 720

OpenCL version

2.0

Vulkan version

1.3

Up to 1300 x 2800

Max display resolution

3360 x 1600

Connectivity

3GPP R16, Global SA & NSA; SA Option2, NSA Option3 / 3a / 3x, NR TDD Band, NR FDD Band, DSS, NR DL 2CC, 140 MHz bandwidth, 256QAM NR UL 1CC, 256QAM VoNR, Dual VoNR, Dual 5G SIM, EPS fallback

Cellular specific functions

2G / 3G / 4G / 5G Multi-Mode, 4G Carrier Aggregation (CA), 5G Carrier Aggregation (CA), EDGE, 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA

Cellular technologies

NR DL 2CC, 140 MHz bandwidth

Downlink functions

3.3Gbps

Download speed

Up to 5000 Mbps

MediaTek 5G UltraSave 3.0+

Modem power saving technologies

256QAM NR UL 1CC

Uplink functions