MediaTek Dimensity 7025
vs
Qualcomm Snapdragon 7s Gen 3

vs

SoC Comparison Result

Below are the results of a comparison of MediaTek Dimensity 7025 and Qualcomm Snapdragon 7s Gen 3 mobile processors based on key performance characteristics, as well as power consumption and much more.

Advantages

  • Higher Technology: 4 nm (6 nm vs 4 nm)
  • Newer Launch Date: August 2024 (April 2024 vs August 2024)

Basic

MediaTek
Label Name
Qualcomm
April 2024
Launch Date
August 2024
SmartPhone Mid range
Platform
SmartPhone Mid range
TSMC
Manufacturing
TSMC
Dimensity 7025
Model Name
SM7635
2x 2.5 GHz – Cortex-A78
6x 2 GHz – Cortex-A55
Architecture
1x 2.5 GHz – Kryo Prime
3x 2.4 GHz – Kryo Gold
4x 1.8 GHz – Kryo Silver
8
Cores
8
6 nm
Technology
4 nm
2500 MHz
Frequency
2500 MHz
10
Transistor count
-

GPU Specifications

IMG BXM-8-256
GPU name
-
950 MHz
GPU frequency
-
18
Shading units
-
8
Execution units
-
3.0
OpenCL version
-
1.3
Vulkan version
-
2520 x 1080
Max display resolution
3360 x 1600

Connectivity

Up to 2770 Mbps
Download speed
Up to 2900 Mbps
LTE Cat. 18
4G support
-
Yes
5G support
Yes
5.3
Bluetooth
5.4
5
Wi-Fi
6
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

LPDDR5
Memory type
LPDDR5
3200 MHz
Memory frequency
3200 MHz
4x 16 Bit
Memory Bus
2x 16 Bit

Miscellaneous

AIFF, CAF, MP3, MP4, WAV
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
1x 200MP
Max camera resolution
1x 200MP
UFS 2.2, UFS 3.1
Storage type
UFS 2.2, UFS 3.1
2K at 30FPS
Video capture
4K at 30FPS
H.264, H.265, VP9
Video codecs
H.264, H.265
2K at 30FPS
Video playback
4K at 30FPS
ARMv8.2-A
Instruction set
ARMv8.6-A
Yes
Neural processor (NPU)
Yes

Benchmarks

Geekbench 6 Single Core
Dimensity 7025
1004
Snapdragon 7s Gen 3
1196 +19%
Geekbench 6 Multi Core
Dimensity 7025
2521
Snapdragon 7s Gen 3
3087 +22%
AnTuTu 10
Dimensity 7025
485165
Snapdragon 7s Gen 3
809304 +67%
AntuTu 11
Dimensity 7025
668462
Snapdragon 7s Gen 3
1041899 +56%