Advantages
- Higher Technology: 3 nm (7 nm vs 3 nm)
- Newer Launch Date: November 2025 (July 2025 vs November 2025)
Basic
HiSilicon
Label Name
Qualcomm
July 2025
Launch Date
November 2025
SmartPhone Flagship
Platform
SmartPhone Flagship
-
Manufacturing
TSMC
Kirin 9010s
Model Name
SM8845
2 cores x 2.5GHz + 6 cores x 2.05GHz + 4 cores x 1.50GHz
Architecture
2x 3.8 GHz, 6x 3.32 GHz
12
Cores
8
7 nm
Technology
3 nm
-
Frequency
3800 MHz
GPU Specifications
-
GPU name
Adreno 840
-
GPU frequency
1200 MHz
-
Shading units
512
-
OpenCL version
3.0
-
Vulkan version
1.4
-
Max display resolution
3840 x 2540
-
DirectX version
12.1
Connectivity
-
Download speed
Up to 10000 Mbps
Yes
4G support
LTE Cat. 24
-
5G support
Yes
Bluetooth 5.2, поддержка BLE, SBC, AAC, LDAC и L2HC.
Bluetooth
6.0
802.11a/b/g/n/ac/ax/be, 2 × 2 MIMO, EHT160
Wi-Fi
7
-
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Memory Specifications
-
Memory type
LPDDR5X
-
Memory frequency
4800 MHz
-
Memory Bus
4x 16 Bit
Miscellaneous
-
Audio codecs
- AAC
- AIFF
- CAF
- MP3
- MP4
- WAV
- AIFF
- CAF
- MP3
- MP4
- WAV
-
Max camera resolution
1x 320MP
-
Storage type
UFS 4.0, UFS 4.1
-
Video capture
8K at 60FPS, 4K at 120FPS
-
Video codecs
- H.264
- H.265
- AV1
- VP8
- VP9
- H.265
- AV1
- VP8
- VP9
-
Video playback
8K at 60FPS, 4K at 120FPS
-
Instruction set
ARMv9.2-A
-
Neural processor (NPU)
Hexagon
Benchmarks
Geekbench 6 Single Core
Kirin 9010s
1442
Snapdragon 8 Gen 5
2804
+94%
Geekbench 6 Multi Core
Kirin 9010s
4443
Snapdragon 8 Gen 5
10057
+126%
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