HiSilicon Kirin 9010 vs MediaTek Dimensity 1100
SoC Comparison Result
Below are the results of a comparison of HiSilicon Kirin 9010 and MediaTek Dimensity 1100 mobile processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Higher Max Bandwidth: 44 Gbit/s (44 Gbit/s vs 34.1 Gbit/s)
- Newer Launch Date: April 2024 (April 2024 vs January 2021)
- Higher Technology: 6 nm (7 nm vs 6 nm)
- Higher Frequency: 2600 MHz (2300 MHz vs 2600 MHz)
Basic
HiSilicon
Label Name
MediaTek
April 2024
Launch Date
January 2021
SmartPhone Flagship
Platform
SmartPhone Flagship
SMIC
Manufacturing
TSMC
Kirin 9010
Model Name
MT6891Z/CZA
2x 2.3 GHz – TaiShan V1214x 1.55 GHz – TaiShan V1216x 2.18 GHz – Cortex-A510
Architecture
4x 2.6 GHz – Cortex-A78
4x 2 GHz – Cortex-A55
12
Cores
8
7 nm
Technology
6 nm
2300 MHz
Frequency
2600 MHz
GPU Specifications
Maleoon 910
GPU name
Mali-G77 MP9
750 MHz
GPU frequency
850 MHz
-
FLOPS
0.9792 TFLOPS
-
Shading units
64
-
Execution units
9
-
OpenCL version
2.0
-
Vulkan version
1.3
-
Max display resolution
2520 x 1080
-
DirectX version
12
Connectivity
-
4G support
LTE Cat. 19
-
5G support
Yes
-
Bluetooth
5.2
-
Wi-Fi
6
-
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Memory Specifications
-
Memory type
LPDDR4X
2750 MHz
Memory frequency
2133 MHz
4x 16 Bit
Memory Bus
4x 16 Bit
44 Gbit/s
Max Bandwidth
34.1 Gbit/s
Miscellaneous
-
Neural processor (NPU)
MediaTek APU 3.0
-
L2 Cache
320 KB
-
Audio codecs
AIFF, CAF, MP3, MP4, WAV
-
Max camera resolution
1x 108MP, 2x 32MP
-
Storage type
UFS 3.1
-
Video capture
4K at 60FPS
-
Video codecs
H.264, H.265, AV1, VP9
-
Video playback
4K at 60FPS
-
TDP
10 W
-
Instruction set
ARMv8.2-A
Benchmarks
Geekbench 6 Single Core
Kirin 9010
1413
+28%
Dimensity 1100
1107
Geekbench 6 Multi Core
Kirin 9010
4560
+37%
Dimensity 1100
3332
AnTuTu 10
Kirin 9010
959921
+25%
Dimensity 1100
770936
