Home / CPU Comparison / Qualcomm Snapdragon X Elite X1E-84-100 or Qualcomm Snapdragon X2 Elite X2E-80-100: What's better?

Qualcomm Snapdragon X Elite X1E-84-100
vs
Qualcomm Snapdragon X2 Elite X2E-80-100

Qualcomm Snapdragon X Elite X1E-84-100
vs
Qualcomm Snapdragon X2 Elite X2E-80-100

CPU Comparison Result

Below are the results of a comparison of Qualcomm Snapdragon X Elite X1E-84-100 and Qualcomm Snapdragon X2 Elite X2E-80-100 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Qualcomm Snapdragon X2 Elite X2E-80-100
Qualcomm Snapdragon X2 Elite X2E-80-100
Qualcomm Snapdragon X2 Elite X2E-80-100
  • Higher Technology: 3nm (4 nm vs 3nm)
  • Newer Launch Date: September 2025 (October 2023 vs September 2025)

Basic

Qualcomm
Label Name
Qualcomm
October 2023
Launch Date
September 2025
Laptop
Platform
Laptop
-
CPU Architecture
ARM64-Compatible
-
CPU Name
3rd Gen Qualcomm Oryon CPU
-
Part Number
X2E-80-100
X1E-84-100
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
Qualcomm Snapdragon X2 Elite X2E-80-100
Oryon
Code Name
-

CPU Specifications

-
Boost Frequency
4.7 GHz Single-Core / 4.4 GHz Dual-Core
-
Performance Cores
6
-
Performance-core Multi-Core Max Frequency
3.4 GHz
-
Prime Cores
6
-
Prime-core Multi-Core Max Frequency
4.0 GHz
12
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
12
12
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
-
12
Performance-cores
-
3.8 GHz
Performance-core Base Frequency
-
4.2 GHz
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
-
42 MB
L3 Cache
-
-
Cache
?
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
34 MB
38x
Multiplier
-
No
Unlocked Multiplier
-
4 nm
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
3nm
23-65 W
TDP
-
4.0
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
-
4.0
PCIe Version
?
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
-
Arm-64
Instruction Set
?
The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.
-

Memory Specifications

-
Memory Bus Width
128-bit
LPDDR5x-8448
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
LPDDR5x
64 GB
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
128 GB
8
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
-
135 GB/s
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
152 GB/s
-
Maximum Memory Speed
9523 MT/s
No
ECC Memory Support
-

GPU Specifications

-
Display Processing Unit
Qualcomm Adreno DPU
-
External Display Standard
DisplayPort 1.4
-
GPU APIs
DirectX 12.2 Ultimate, Vulkan 1.4, OpenCL 3.0
Qualcomm Adreno
GPU Name
Qualcomm Adreno GPU
-
GPU Part Number
X2-85
-
Max External Display Resolution
3 displays at up to 4K at 144 Hz or 5K at 60 Hz
-
Max On-Device Display Resolution
4K at 144 Hz
-
On-Device Display Standard
Embedded DisplayPort (eDP) 1.5
-
Video Concurrency
UHD at 60 FPS Encode + 8K at 30 FPS Decode
-
Video Decode
AV1, HEVC, AVC: 8K at 60 FPS
-
Video Encode
HEVC, AVC: 8K UHD at 30 FPS; AV1: 8K UHD at 15 FPS, UHD at 60 FPS
-
Video Processing Unit
Qualcomm Adreno VPU
True
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
-
500 MHz
GPU Base Frequency
-
1500 MHz
GPU Max Dynamic Frequency
-
-
Graphics Frequency
?
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
1.70 GHz
6
Execution Units
?
The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.
-
4.6 TFLOPS
Graphics Performance
-

AI Specifications

-
Micro NPU
Dual Micro NPU on the Qualcomm Sensing Hub
-
NPU Name
Qualcomm Hexagon NPU
-
NPU Performance
80 TOPS (INT8)

Connectivity

-
Bluetooth Connection Technology
Bluetooth LE
-
Bluetooth Version
Bluetooth 5.4
-
Cellular Bandwidth
Up to 1000 MHz (5G)
-
Cellular Modem
Snapdragon X75 5G Modem-RF System
-
Cellular Peak Download Speed
Up to 10 Gbps
-
Cellular Peak Upload Speed
Up to 3.5 Gbps
-
Wi-Fi Bands
6 GHz, 5 GHz, 2.4 GHz
-
Wi-Fi Standard
Wi-Fi 7 (802.11be), 802.11ax, 802.11ac, 802.11n, 802.11g, 802.11b, 802.11a
-
Wireless System
Qualcomm FastConnect 7800 System

Interfaces and Ports

-
NVMe Support
Supported via Dual PCIe 5.0
-
PCIe Gen 4.0 Lanes
4
-
PCIe Gen 5.0 Lanes
8
-
SD Standard
SDUC with SD Express, SDXC with UHS-I
-
UFS Version
4.0
-
USB Interface Type
3x USB-C
-
USB Version
USB4 (40 Gbps)

Miscellaneous

-
Always Sensing
Supported
-
Audio Technology
Qualcomm Aqstic Audio Codec, Qualcomm aptX Audio Technology
-
Dual Camera Support
Up to 36 MP
-
Image Signal Processor
Qualcomm Spectra ISP
-
ISP Bit Width
Dual 18-bit ISPs
-
Out-of-Band Manageability
Snapdragon Guardian Technology
-
Single Camera Support
Up to 36 MP
-
Video Capture
Up to 4K, 30 FPS

Benchmarks

Geekbench 6 Single Core
Snapdragon X Elite X1E-84-100
2838
Snapdragon X2 Elite X2E-80-100
3811 +34%
Geekbench 6 Multi Core
Snapdragon X Elite X1E-84-100
15135
Snapdragon X2 Elite X2E-80-100
16041 +6%
Cinebench 2024 Single Core
Snapdragon X Elite X1E-84-100
135
Snapdragon X2 Elite X2E-80-100
152 +13%
Cinebench 2024 Multi Core
Snapdragon X Elite X1E-84-100
1203 +6%
Snapdragon X2 Elite X2E-80-100
1138