Home / CPU Comparison / Intel Xeon 6315P or Intel Xeon E5-2697 v3: What's better?

Intel Xeon 6315P

vs

Intel Xeon E5-2697 v3

CPU Comparison Result

Below are the results of a comparison of Intel Xeon 6315P and Intel Xeon E5-2697 v3 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Intel Xeon 6315P

Higher Performance-core Max Turbo Frequency: 4.7 GHz (4.7 GHz vs 3.6 GHz)
Higher Technology: 10 nm (10 nm vs 22 nm)
Higher Memory Type: DDR4-3200, DDR5-4800 (DDR4-3200, DDR5-4800 vs DDR4-2133)
Newer Launch Date: February 2025 (February 2025 vs September 2014)

Intel Xeon E5-2697 v3

More Total Cores: 14 (4 vs 14)
Larger L3 Cache: 35MB shared (12 MB shared vs 35MB shared)

Basic

Intel

Label Name

Intel

February 2025

Launch Date

September 2014

Server

Platform

Server

Xeon 6315P

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Xeon E5-2697 v3

Raptor Lake-R

Code Name

Haswell-EP

Intel

Foundry

Intel

Xeon 6 (Raptor Lake Refresh)

Generation

Xeon E5 (Haswell-EP)

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

2.8 GHz

Performance-core Base Frequency

2.6 GHz

4.7 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

3.6 GHz

80 KB per core

L1 Cache

64K per core

1.25 MB per core

L2 Cache

256K per core

12 MB shared

L3 Cache

35MB shared

100 MHz

Bus Frequency

100MHz

Intel Socket 1700

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

Intel Socket 2011-3

28.0

Multiplier

26.0

Unlocked Multiplier

10 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

22 nm

55 W

TDP

145 W

100°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

77 °C

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

Transistor Count

2.6 billions

Memory Specifications

DDR4-3200, DDR5-4800

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR4-2133

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

76.8 GB/s

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

Yes

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Yes