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Intel Core Ultra 9 285K

vs

Intel Xeon 658X

CPU Comparison Result

Below are the results of a comparison of Intel Core Ultra 9 285K and Intel Xeon 658X processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Intel Core Ultra 9 285K

Higher Performance-core Max Turbo Frequency: 5.7 GHz (5.7 GHz vs 4.9 GHz)
Higher Technology: 3 nm (3 nm vs 5 nm)

Intel Xeon 658X

Larger L3 Cache: 144 MB shared (36 MB shared vs 144 MB shared)
Newer Launch Date: February 2026 (December 2024 vs February 2026)

Basic

Intel

Label Name

Intel

December 2024

Launch Date

February 2026

Desktop

Platform

Server

Core Ultra 9 285K

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Xeon 658X

Arrow Lake

Code Name

Granite Rapids

Intel

Foundry

Intel

Ultra 9 (Arrow Lake)

Generation

Xeon 600 (Granite Rapids-WS)

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Efficient-cores

3.7 GHz

Performance-core Base Frequency

3 GHz

3.2 GHz

Efficient-core Base Frequency

4.6 GHz

Efficient-core Max Turbo Frequency

Maximum E-core turbo frequency derived from Intel® Turbo Boost Technology.

5.7 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

4.9 GHz

L1 Cache

112 KB per core

40 MB

L2 Cache

2 MB per core

36 MB shared

L3 Cache

144 MB shared

100 MHz

Bus Frequency

100 MHz

Intel Socket 1851

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

Intel Socket 4710

Multiplier

30.0

Yes

Unlocked Multiplier

Yes

3 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

5 nm

125 W

TDP

250 W

105 °C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

99°C

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

Memory Specifications

DDR5-6400

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR5-6400

256 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

4 TB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

102.4 GB/s

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

409.6 GB/s

Yes

ECC Memory Support

Yes

GPU Specifications

true

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

300 MHz

GPU Base Frequency

2000 MHz

GPU Max Dynamic Frequency

Execution Units

The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.

1.79 TFLOPS

Graphics Performance