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Apple M3 vs AMD Ryzen 7 7840H

Apple M3

AMD Ryzen 7 7840H

CPU Comparison Result

Below are the results of a comparison of Apple M3 and AMD Ryzen 7 7840H processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Apple M3

Larger L3 Cache: 64MB shared (64MB shared vs 16MB shared)
Higher Technology: 3 nm (3 nm vs 4 nm)
Newer Launch Date: October 2023 (October 2023 vs January 2023)

AMD Ryzen 7 7840H

Higher Performance-core Max Turbo Frequency: 5.1 GHz (4.05 GHz vs 5.1 GHz)

Basic

Apple

Label Name

AMD

October 2023

Launch Date

January 2023

Laptop

Platform

Laptop

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Ryzen 7 7840H

Apple M3

Code Name

Phoenix

Foundry

TSMC

Generation

Ryzen 7 (Zen 4 (Phoenix))

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Efficient-cores

3.6 GHz

Performance-core Base Frequency

3.8 GHz

2.48 GHz

Efficient-core Base Frequency

4.05 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

5.1 GHz

192K per core

L1 Cache

64K per core

8MB per core

L2 Cache

1MB per core

64MB shared

L3 Cache

16MB shared

Apple M-Socket

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

AMD Socket FP8

Unlocked Multiplier

Multiplier

38.0

Bus Frequency

100MHz

3 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

4 nm

25 W

TDP

35 W

100°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100 °C

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

Transistor Count

25 billions

Memory Specifications

LPDDR5-6400

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR5-5600

24GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

256GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

89.6 GB/s

ECC Memory Support

Yes

GPU Specifications

True

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

True

GPU Max Dynamic Frequency

2700 MHz

Execution Units

The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.

Graphics Performance

10 TFLOPS