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AMD Ryzen 9 7940H vs AMD Ryzen 9 7940HX

AMD Ryzen 9 7940H

AMD Ryzen 9 7940HX

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 9 7940H and AMD Ryzen 9 7940HX processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen 9 7940H

Higher Technology: 4 nm (4 nm vs 5 nm)

AMD Ryzen 9 7940HX

More Total Cores: 16 (8 vs 16)
Larger L3 Cache: 64MB (16 MB (shared) vs 64MB)
Newer Launch Date: January 2024 (January 2023 vs January 2024)

Basic

AMD

Label Name

AMD

January 2023

Launch Date

January 2024

Mobile

Platform

Laptop

Ryzen 9 7940H

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Ryzen 9 7940HX

Phoenix

Code Name

Zen 4 (Dragon Range)

Ryzen 9 (Zen 4 (Phoenix))

Generation

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

4 GHz

Basic Frequency

up to 5.2 GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Performance-core Base Frequency

2.4 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

5.2 GHz

64 KB (per core)

L1 Cache

64K per core

1 MB (per core)

L2 Cache

1MB per core

16 MB (shared)

L3 Cache

64MB

AMD Socket FP8

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

AMD Socket FL1

Multiplier Unlocked

100 MHz

Bus Frequency

100MHz

40.0x

Multiplier

Unlocked Multiplier

Yes

4 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

5 nm

35 W

TDP

15 W

100°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100°C

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

5.0

Gen 4, 20 Lanes (CPU only)

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Instruction Set

The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.

x86-64

Transistor Count

13.14 billions

25,000 million

Transistors

Memory Specifications

DDR5

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR5-5200

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

64GB

Dual-channel

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

83.2 GB/s

Yes

ECC Memory

GPU Specifications

Radeon 780M

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

True

GPU Base Frequency

400 MHz

GPU Max Dynamic Frequency

2200 MHz

Execution Units

The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.

Graphics Performance

0.563 TFLOPS