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AMD Ryzen 9 5900H vs Intel Core i7-13700HX

AMD Ryzen 9 5900H

Intel Core i7-13700HX

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 9 5900H and Intel Core i7-13700HX processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Intel Core i7-13700HX

More Total Cores: 16 (8 vs 16)
Larger L3 Cache: 30 MB (16MB shared vs 30 MB)
Higher Memory Type: Up to DDR5 4800 MT/s Up to DDR4 3200 MT/s (LPDDR4-4266 vs Up to DDR5 4800 MT/s Up to DDR4 3200 MT/s)
Newer Launch Date: January 2023 (April 2021 vs January 2023)

Basic

AMD

Label Name

Intel

April 2021

Launch Date

January 2023

Laptop

Platform

Mobile

Ryzen 9 5900H

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

i7-13700HX

Cezanne

Code Name

Raptor Lake

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Efficient-cores

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

5.00 GHz

3.3 GHz

Performance-core Base Frequency

4.6 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

64K per core

L1 Cache

512K per core

L2 Cache

16MB shared

L3 Cache

30 MB

FP6

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FCBGA1964

100MHz

Bus Frequency

33x

Multiplier

Unlocked Multiplier

7 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Intel 7

15 W

TDP

55 W

Processor Base Power

The time-averaged power dissipation that the processor is validated to not exceed during manufacturing while executing an Intel-specified high complexity workload at Base Frequency and at the junction temperature as specified in the Datasheet for the SKU segment and configuration.

55 W

Maximum Turbo Power

The maximum sustained (>1s) power dissipation of the processor as limited by current and/or temperature controls. Instantaneous power may exceed Maximum Turbo Power for short durations (<=10ms). Note: Maximum Turbo Power is configurable by system vendor and can be system specific.

157 W

105 °C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100°C

3.0

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

5.0 and 4.0

x86-64

Instruction Set

The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.

Memory Specifications

LPDDR4-4266

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Up to DDR5 4800 MT/s Up to DDR4 3200 MT/s

64GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

192 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

68.27 GB/s

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

Yes

ECC Memory Support

GPU Specifications

True

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

Intel® UHD Graphics for 13th Gen Intel® Processors

1750 MHz

GPU Max Dynamic Frequency

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

1.55 GHz