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AMD Ryzen 5 1600X

vs

AMD Ryzen 9 5900HX

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 5 1600X and AMD Ryzen 9 5900HX processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen 5 1600X

Newer PCI Express Version: PCIe 3.0 x16 (PCIe 3.0 x16 vs PCIe® 3.0)

AMD Ryzen 9 5900HX

More Total Cores: 8 (6 vs 8)
Higher Max Turbo Frequency: Up to 4.6GHz (Up to 4.0GHz vs Up to 4.6GHz)
Higher Technology: TSMC 7nm FinFET (14nm vs TSMC 7nm FinFET)
Newer Launch Date: January 2021 (April 2017 vs January 2021)

Basic

AMD

Label Name

AMD

April 2017

Launch Date

January 2021

Desktop

Platform

Laptop

Summit Ridge

Code Name

Cezanne

Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.

OS Support

Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

3.6GHz

Basic Frequency

3.3GHz

Up to 4.0GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Up to 4.6GHz

576KB

L1 Cache

3MB

L2 Cache

4MB

16MB

L3 Cache

16MB

AM4

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FP6

Yes

Unlocked for Overclocking

AMD`s product warranty does not cover damages caused by overclocking, even when overclocking is enabled via AMD hardware and/or software. GD-26.

14nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 7nm FinFET

95W

TDP

45+W

95°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

105°C

PCIe 3.0 x16

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 3.0

Memory Specifications

DDR4

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Up to 2667MT/s

Bus Speed

GPU Specifications

Discrete Graphics Card Required

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ Graphics

Graphics Core Count

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

2100 MHz