AMD Ryzen 3 3200U
vs
Apple M3

vs

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 3 3200U and Apple M3 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

  • More Total Cores: 8 (2 vs 8)
  • Higher Technology: 3 nm (14nm vs 3 nm)
  • Newer Launch Date: October 2023 (January 2019 vs October 2023)

Basic

AMD
Label Name
Apple
January 2019
Launch Date
October 2023
Laptop
Platform
Laptop
-
CPU Architecture
Apple M3 performance cores + efficiency cores
-
CPU Name
Apple M3
-
Model Name
Apple M3
Picasso
Code Name
-
-
Foundry
TSMC
-
Generation
Apple M3 series
Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.
OS Support
-

CPU Specifications

2
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
8
4
Total Threads
8
-
Performance-cores
4
-
Efficient-cores
4
2.6GHz
Basic Frequency
-
Up to 3.5GHz
Max Turbo Frequency
-
-
Efficient-core Max Turbo Frequency
2.75 GHz
-
Instruction Set Extensions
NEON
-
Performance-core Max Turbo Frequency
4.06 GHz
-
Extended Instruction Set
ARMv8.6-A, NEON
192KB
L1 Cache
P-cores: 192 KB instruction + 128 KB data per core; E-cores: 128 KB instruction + 64 KB data per core
1MB
L2 Cache
P-core cluster: 16 MB; E-core cluster: 4 MB
4MB
L3 Cache
-
FP5
CPU Socket
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
-
No
Unlocked for Overclocking
-
14nm
Technology
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
3 nm
15W
TDP
-
105°C
Max. Operating Temperature
Junction Temperature is the maximum temperature allowed at the processor die.
-
PCIe® 3.0
PCI Express Version
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
-
-
Instruction Set
An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.
ARMv8.6-A
-
Transistor Count
25 billion

Memory Specifications

-
Memory Bus Width
128-bit
-
Memory Type
Unified LPDDR5-6400
-
LPDDR5 Speed
LPDDR5-6400
-
Max Memory Size
Max memory size refers to the maximum memory capacity supported by the processor.
24 GB
2
Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
-
Up to 2400MT/s
Bus Speed
-
-
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
100 GB/s
-
Maximum Memory Speed
6400 MT/s

GPU Specifications

-
External Display Standard
Thunderbolt 3 / USB4 with DisplayPort, HDMI
-
GPU Name
Apple M3 GPU
-
Max External Display Resolution
Up to 6K 60Hz external display; up to 5K 60Hz second external display with lid closed; HDMI up to 4K 120Hz
-
Video Concurrency
Hardware-accelerated video encode/decode; AV1 decode
-
Video Decode
H.264, HEVC, ProRes, ProRes RAW, AV1 decode
-
Video Encode
H.264, HEVC, ProRes, ProRes RAW
-
Video Processing Unit
Apple media engine with ProRes acceleration and AV1 decode
Radeon™ Vega 3 Graphics
Integrated Graphics Model
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
-
-
GPU Max Dynamic Frequency
1400 MHz
3
Graphics Core Count
8/9/10
1200 MHz
Graphics Frequency
-
-
Number of Displays Supported
Up to 2 external displays with lid closed
-
GPU APIs
Metal, OpenCL
-
Graphics Performance
Up to 3.55 TFLOPS FP32
-
Media Engine
Hardware-accelerated H.264, HEVC, ProRes, ProRes RAW, and AV1 decode
-
Video Decode Engines
1
-
Video Encode Engines
1
-
ProRes Encode/Decode Engines
1
-
OpenCL Support
OpenCL (Open Computing Language) is a multi-platform API (Application Programming Interface) for heterogeneous parallel programming.
Yes

AI Specifications

-
AI Engine
16-core Apple Neural Engine
-
Neural Engine Core Count
16
-
NPU Name
Apple Neural Engine
-
NPU Performance
18 TOPS

Connectivity

-
Bluetooth Support
Yes

Interfaces and Ports

-
Thunderbolt Support
Yes, Thunderbolt 3 up to 40 Gb/s
-
USB Version
USB4
-
USB4 Support
Yes, USB4 up to 40 Gb/s

Miscellaneous

-
Hardware-Verified Secure Boot
Yes, Apple silicon secure boot chain of trust
-
Runtime Anti-Exploitation
Kernel Integrity Protection, Pointer Authentication Codes, Fast Permission Restrictions

Benchmarks

Geekbench 6 Single Core
Ryzen 3 3200U
777
Apple M3
3075 +296%
Geekbench 6 Multi Core
Ryzen 3 3200U
1487
Apple M3
11525 +675%
Geekbench 5 Single Core
Ryzen 3 3200U
705
Apple M3
2150 +205%
Geekbench 5 Multi Core
Ryzen 3 3200U
1525
Apple M3
10450 +585%
Passmark CPU Single Core
Ryzen 3 3200U
1816
Apple M3
4712 +159%
Passmark CPU Multi Core
Ryzen 3 3200U
3827
Apple M3
19087 +399%