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AMD Ryzen 3 2200GE

vs

AMD Ryzen 3 3200GE

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 3 2200GE and AMD Ryzen 3 3200GE processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen 3 3200GE

Higher Technology: 12 nm (14 nm vs 12 nm)
Newer Launch Date: July 2019 (April 2018 vs July 2019)

Basic

AMD

Label Name

AMD

April 2018

Launch Date

July 2019

Desktop

Platform

Desktop

Ryzen 3 2200GE

Model Name

Ryzen 3 3200GE

Raven Ridge

Code Name

Picasso

Ryzen 3 (Zen (Raven Ridge))

Generation

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Performance-cores

3.2 GHz

Basic Frequency

up to 3.6 GHz

Max Turbo Frequency

Performance-core Base Frequency

3.3 GHz

Performance-core Max Turbo Frequency

3.8 GHz

128 KB (per core)

L1 Cache

96K per core

512 KB (per core)

L2 Cache

512K per core

4 MB (shared)

L3 Cache

4MB shared

100 MHz

Bus Frequency

100MHz

AMD Socket AM4

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

AM4

32.0x

Multiplier

33x

Yes

Multiplier Unlocked

Unlocked Multiplier

Yes

14 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

12 nm

35 W

TDP

35 W

95°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

95 °C

Gen 3, 8 Lanes (CPU only)

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

3.0

Instruction Set

An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.

x86-64

4,950 million

Transistor Count

Memory Specifications

DDR4

Memory Type

DDR4-2933

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

64GB

Dual-channel

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

43.71 GB/s

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Yes

GPU Specifications

Radeon Vega 8

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

True

GPU Max Dynamic Frequency

1200 MHz