Intel Xeon E5-2693 v3
About processor
The Intel Xeon E5-2693 v3 is a powerful 12-core, 24-thread processor designed for server platforms. Built on 22 nm technology and codenamed Haswell-EP, this CPU delivers exceptional performance and efficiency for demanding server workloads.
With a total of 30MB of L3 cache and a TDP of 160W, the Xeon E5-2693 v3 offers impressive multi-tasking capabilities and is well-suited for multi-threaded applications. Its high core and thread count make it a great choice for virtualization, rendering, and other compute-intensive tasks. The processor's architecture allows for efficient data processing and enhanced server performance.
The Xeon E5-2693 v3 is a reliable and stable choice for server deployments, offering a strong balance of power and energy efficiency. Its advanced features, such as Intel Turbo Boost and Intel Hyper-Threading, further enhance its performance capabilities.
Overall, the Intel Xeon E5-2693 v3 processor offers high performance, scalability, and reliability, making it an excellent choice for server applications that require significant computational power. Its robust specifications and advanced technologies make it a solid investment for businesses and organizations looking to optimize their server infrastructure.
Basic
Label Name
Intel
Platform
Server
Model Name
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The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
Xeon E5-2693 v3
Code Name
Haswell-EP
CPU Specifications
Total Cores
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Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
12
Total Threads
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Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
24
Basic Frequency
2.8 GHz
Max Turbo Frequency
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Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
up to 3.4 GHz
L1 Cache
64 KB (per core)
L2 Cache
256 KB (per core)
L3 Cache
30 MB (shared)
CPU Socket
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The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
Intel Socket 2011-3
Technology
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Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
22 nm
TDP
160 W
Max. Operating Temperature
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Junction Temperature is the maximum temperature allowed at the processor die.
90°C
PCI Express Version
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PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
Gen 3, 40 Lanes (CPU only)
Memory Specifications
Memory Type
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Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR4
Memory Channels
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The number of memory channels refers to the bandwidth operation for real world application.
Quad-channel
GPU Specifications
Integrated Graphics Model
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An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
N/A