Intel Core i3-7100E
About processor
The Intel Core i3-7100E processor is a solid choice for embedded systems requiring efficient performance and low power consumption. With a TDP of 35 W and built on the 14nm Kaby Lake architecture, this processor delivers a good balance of power and energy efficiency.
The two cores and four threads provide sufficient multitasking capabilities for most embedded applications, making it suitable for a wide range of uses such as digital signage, point-of-sale systems, and industrial automation. The processor also supports advanced technologies such as Intel Virtualization Technology and Intel AES New Instructions, expanding its capabilities for virtualized environments and security-sensitive applications.
While the Core i3-7100E may not be the most powerful option on the market, it excels in its intended niche of embedded systems by offering reliable performance and low power consumption. It is a cost-effective solution for applications that do not require the highest levels of processing power, making it a popular choice for many embedded system designers.
Overall, the Intel Core i3-7100E processor offers a good combination of performance, energy efficiency, and advanced features, making it a strong choice for embedded applications that require reliable processing capabilities.
Basic
Label Name
Intel
Platform
Embedded
Launch Date
January 2017
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
i3-7100E
Code Name
Kaby Lake
CPU Specifications
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
2
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
4
Basic Frequency
2.90 GHz
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FCBGA1440
Technology
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Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
14 nm
TDP
35 W
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
100°C
PCI Express Version
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PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
3.0
Instruction Set
?
The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.
64-bit
Memory Specifications
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR4-2400
Max Memory Size
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Max memory size refers to the maximum memory capacity supported by the processor.
64 GB
Memory Channels
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The number of memory channels refers to the bandwidth operation for real world application.
2
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
34.1 GB/s
GPU Specifications
GPU Name
Intel® HD Graphics 630
Graphics Frequency
?
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
950 MHz