Home / CPU Comparison / Qualcomm Snapdragon X2 Elite X2E-88-100 or Intel Core i7-14700HX: What's better?

Qualcomm Snapdragon X2 Elite X2E-88-100

vs

Intel Core i7-14700HX

CPU Comparison Result

Below are the results of a comparison of Qualcomm Snapdragon X2 Elite X2E-88-100 and Intel Core i7-14700HX processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Qualcomm Snapdragon X2 Elite X2E-88-100

Higher Technology: 3nm (3nm vs Intel 7)
Newer Launch Date: September 2025 (September 2025 vs January 2024)

Intel Core i7-14700HX

More Total Cores: 20 (18 vs 20)

Basic

Qualcomm

Label Name

Intel

September 2025

Launch Date

January 2024

Laptop

Platform

Mobile

ARM64-Compatible

CPU Architecture

3rd Gen Qualcomm Oryon CPU

CPU Name

X2E-88-100

Part Number

Qualcomm Snapdragon X2 Elite X2E-88-100

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

i7-14700HX

Code Name

Raptor Lake

CPU Specifications

4.7 GHz Single-Core / 4.7 GHz Dual-Core

Boost Frequency

3.4 GHz

Performance-core Multi-Core Max Frequency

4.0 GHz

Prime-core Multi-Core Max Frequency

Prime-cores

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Efficient-cores

Performance-core Base Frequency

2.1 GHz

Efficient-core Base Frequency

1.5 GHz

Efficient-core Max Turbo Frequency

Maximum E-core turbo frequency derived from Intel® Turbo Boost Technology.

3.9 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

5.5 GHz

L3 Cache

33 MB

53 MB

Cache

CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FCBGA1964

3nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Intel 7

TDP

55 W

Processor Base Power

The time-averaged power dissipation that the processor is validated to not exceed during manufacturing while executing an Intel-specified high complexity workload at Base Frequency and at the junction temperature as specified in the Datasheet for the SKU segment and configuration.

55 W

Maximum Turbo Power

The maximum sustained (>1s) power dissipation of the processor as limited by current and/or temperature controls. Instantaneous power may exceed Maximum Turbo Power for short durations (<=10ms). Note: Maximum Turbo Power is configurable by system vendor and can be system specific.

157 W

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100°C

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

5.0 and 4.0

Memory Specifications

128-bit

Memory Bus Width

LPDDR5x

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Up to DDR5 5600 MT/s Up to DDR4 3200 MT/s

128 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

192 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

152 GB/s

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

9523 MT/s

Maximum Memory Speed

GPU Specifications

Qualcomm Adreno DPU

Display Processing Unit

DisplayPort 1.4

External Display Standard

Qualcomm Adreno GPU

GPU Name

X2-90

GPU Part Number

3 displays at up to 4K at 144 Hz or 5K at 60 Hz

Max External Display Resolution

4K at 144 Hz

Max On-Device Display Resolution

Embedded DisplayPort (eDP) 1.5

On-Device Display Standard

8K UHD at 30 FPS Encode + 8K at 60 FPS Decode

Video Concurrency

AV1, HEVC, AVC: Dual 8K at 60 FPS

Video Decode

HEVC, AVC: Dual 8K UHD at 30 FPS; AV1: 8K UHD at 15 FPS, UHD at 60 FPS

Video Encode

Qualcomm Adreno VPU

Video Processing Unit

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

Intel® UHD Graphics for 14th Gen Intel® Processors

1.70 GHz

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

1.6 GHz

DirectX 12.2 Ultimate, Vulkan 1.4, OpenCL 3.0

GPU APIs