Advantages
- Higher Technology: 3nm (3nm vs Intel 7)
- Newer Launch Date: September 2025 (September 2025 vs January 2024)
- More Total Cores: 20 (18 vs 20)
Basic
Qualcomm
Label Name
Intel
September 2025
Launch Date
January 2024
Laptop
Platform
Mobile
ARM64-Compatible
CPU Architecture
-
3rd Gen Qualcomm Oryon CPU
CPU Name
-
X2E-88-100
Part Number
-
Qualcomm Snapdragon X2 Elite X2E-88-100
Model Name
i7-14700HX
-
Code Name
Raptor Lake
CPU Specifications
4.7 GHz Single-Core / 4.7 GHz Dual-Core
Boost Frequency
-
3.4 GHz
Performance-core Multi-Core Max Frequency
-
4.0 GHz
Prime-core Multi-Core Max Frequency
-
12
Prime-cores
-
18
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
20
-
Total Threads
28
6
Performance-cores
8
-
Efficient-cores
12
-
Performance-core Base Frequency
2.1 GHz
-
Efficient-core Base Frequency
1.5 GHz
-
Efficient-core Max Turbo Frequency
3.9 GHz
-
Performance-core Max Turbo Frequency
5.5 GHz
-
L3 Cache
33 MB
53 MB
Cache
-
-
CPU Socket
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FCBGA1964
3nm
Technology
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Intel 7
-
TDP
55 W
-
Processor Base Power
55 W
-
Maximum Turbo Power
157 W
-
Max. Operating Temperature
Junction Temperature is the maximum temperature allowed at the processor die.
100°C
-
PCI Express Version
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
5.0 and 4.0
Memory Specifications
128-bit
Memory Bus Width
-
LPDDR5x
Memory Type
Up to DDR5 5600 MT/s Up to DDR4 3200 MT/s
128 GB
Max Memory Size
Max memory size refers to the maximum memory capacity supported by the processor.
192 GB
-
Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
2
152 GB/s
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
-
9523 MT/s
Maximum Memory Speed
-
GPU Specifications
Qualcomm Adreno DPU
Display Processing Unit
-
DisplayPort 1.4
External Display Standard
-
Qualcomm Adreno GPU
GPU Name
-
X2-90
GPU Part Number
-
3 displays at up to 4K at 144 Hz or 5K at 60 Hz
Max External Display Resolution
-
4K at 144 Hz
Max On-Device Display Resolution
-
Embedded DisplayPort (eDP) 1.5
On-Device Display Standard
-
8K UHD at 30 FPS Encode + 8K at 60 FPS Decode
Video Concurrency
-
AV1, HEVC, AVC: Dual 8K at 60 FPS
Video Decode
-
HEVC, AVC: Dual 8K UHD at 30 FPS; AV1: 8K UHD at 15 FPS, UHD at 60 FPS
Video Encode
-
Qualcomm Adreno VPU
Video Processing Unit
-
-
Integrated Graphics Model
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
Intel® UHD Graphics for 14th Gen Intel® Processors
1.70 GHz
Graphics Frequency
1.6 GHz
DirectX 12.2 Ultimate, Vulkan 1.4, OpenCL 3.0
GPU APIs
-
AI Specifications
Dual Micro NPU on the Qualcomm Sensing Hub
Micro NPU
-
Qualcomm Hexagon NPU
NPU Name
-
80 TOPS (INT8)
NPU Performance
-
Connectivity
Bluetooth LE
Bluetooth Connection Technology
-
Bluetooth 5.4
Bluetooth Version
-
Up to 1000 MHz (5G)
Cellular Bandwidth
-
Snapdragon X75 5G Modem-RF System
Cellular Modem
-
Up to 10 Gbps
Cellular Peak Download Speed
-
Up to 3.5 Gbps
Cellular Peak Upload Speed
-
6 GHz, 5 GHz, 2.4 GHz
Wi-Fi Bands
-
Wi-Fi 7 (802.11be), 802.11ax, 802.11ac, 802.11n, 802.11g, 802.11b, 802.11a
Wi-Fi Standard
-
Qualcomm FastConnect 7800 System
Wireless System
-
Interfaces and Ports
4
PCIe Gen 4.0 Lanes
-
12
PCIe Gen 5.0 Lanes
-
SDUC with SD Express, SDXC with UHS-I
SD Standard
-
4.0
UFS Version
-
3x USB-C
USB Interface Type
-
USB4 (40 Gbps)
USB Version
-
Miscellaneous
Supported
Always Sensing
-
Qualcomm Aqstic Audio Codec, Qualcomm aptX Audio Technology
Audio Technology
-
Up to 36 MP
Dual Camera Support
-
Qualcomm Spectra ISP
Image Signal Processor
-
Dual 18-bit ISPs
ISP Bit Width
-
Out-of-Band Management via Cellular & Wi-Fi
Out-of-Band Manageability
-
Up to 36 MP
Single Camera Support
-
Up to 4K, 30 FPS
Video Capture
-
Benchmarks
Geekbench 6 Single Core
Snapdragon X2 Elite X2E-88-100
3622
+24%
Core i7-14700HX
2921
Geekbench 6 Multi Core
Snapdragon X2 Elite X2E-88-100
19006
+9%
Core i7-14700HX
17475
Geekbench 7 Single Core
Snapdragon X2 Elite X2E-88-100
3151
+46%
Core i7-14700HX
2151
Geekbench 7 Multi Core
Snapdragon X2 Elite X2E-88-100
22206
+53%
Core i7-14700HX
14468
Passmark CPU Single Core
Snapdragon X2 Elite X2E-88-100
4778
+26%
Core i7-14700HX
3782
Passmark CPU Multi Core
Snapdragon X2 Elite X2E-88-100
41265
+10%
Core i7-14700HX
37592
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