Qualcomm Snapdragon X Plus X1P-42-100
vs
Intel Core Ultra 5 225H
vs
CPU Comparison Result
Below are the results of a comparison of
Qualcomm Snapdragon X Plus X1P-42-100
and
Intel Core Ultra 5 225H
processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- More Total Cores: 14 (8 vs 14)
- Higher Technology: 3 nm (4nm vs 3 nm)
- Newer Launch Date: January 2025 (September 2024 vs January 2025)
Basic
Qualcomm
Label Name
Intel
September 2024
Launch Date
January 2025
Laptop
Platform
Laptop
64-bit architecture
CPU Architecture
-
Qualcomm Oryon CPU
CPU Name
-
X1P-42-100
Part Number
-
Qualcomm Snapdragon X Plus X1P-42-100
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
225H
-
Code Name
Arrow Lake
CPU Specifications
3.4 GHz Single-Core
Boost Frequency
-
8
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
14
-
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
14
-
Performance-cores
4
-
Efficient-cores
8
-
Performance-core Base Frequency
1.7 GHz
-
Efficient-core Base Frequency
1.3 GHz
-
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
4.9 GHz
-
L1 Cache
112 K per core
-
L2 Cache
2 MB per core
-
L3 Cache
18 MB shared
-
Bus Frequency
100 MHz
30 MB
Cache
?
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
-
-
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FCBGA-2049
-
Multiplier
17
-
Unlocked Multiplier
No
4nm
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
3 nm
-
TDP
20-28 W
-
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
110 °C
-
PCIe Version
?
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
5.0
-
Instruction Set
?
The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.
x86-64
Memory Specifications
16-bit x 8 channels
Memory Bus Width
-
LPDDR5x
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
LPDDR5-8400,LPDDR5x-8400,DDR5-6400
64 GB
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
128 GB
8
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
2
135 GB/s
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
-
8448 MT/s
Maximum Memory Speed
-
-
ECC Memory Support
No
GPU Specifications
Qualcomm Adreno DPU
Display Processing Unit
-
DisplayPort 1.4
External Display Standard
-
Qualcomm Adreno GPU
GPU Name
-
X1-45
GPU Part Number
-
3 displays up to UHD60 Hz HDR10, 2 displays up to 5K60 or UHD120
Max External Display Resolution
-
Up to UHD120Hz HDR10
Max On-Device Display Resolution
-
eDP v1.4b
On-Device Display Standard
-
4K 30 fps 8-bit decode + 1080p 30 fps encode; 1080p 60 fps 10-bit decode + 1080p 30 fps encode
Video Concurrency
-
4K 30 fps 10-bit playback: HEVC, VP9, AV1; 4K 60 fps 8-bit playback: H.264, HEVC
Video Decode
-
4K UHD 30 fps 8-bit recording: H.264, HEVC, AV1
Video Encode
-
Qualcomm Adreno VPU
Video Processing Unit
-
-
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
true
-
GPU Max Dynamic Frequency
2200 MHz
1.25 GHz
Graphics Frequency
?
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
-
DirectX 12
GPU APIs
-
1.7 TFLOPS
Graphics Performance
-
AI Specifications
Dual Micro NPU on the Qualcomm Sensing Hub
Micro NPU
-
Qualcomm Hexagon NPU
NPU Name
-
45 TOPS
NPU Performance
-
Connectivity
Bluetooth LE
Bluetooth Connection Technology
-
Bluetooth 5.4
Bluetooth Version
-
1000 MHz bandwidth mmWave, 300 MHz bandwidth sub-6 GHz
Cellular Bandwidth
-
Snapdragon X65 5G Modem-RF System
Cellular Modem
-
10 Gbps
Cellular Peak Download Speed
-
3.5 Gbps
Cellular Peak Upload Speed
-
6 GHz, 5 GHz, 2.4 GHz
Wi-Fi Bands
-
Wi-Fi 7, Wi-Fi 6E, Wi-Fi 6; 802.11be, 802.11ax, 802.11ac, 802.11n, 802.11g, 802.11b, 802.11a
Wi-Fi Standard
-
Qualcomm FastConnect 7800 Mobile Connectivity System
Wireless System
-
Interfaces and Ports
NVMe SSD over PCIe Gen 4
NVMe Support
-
SD v3.0
SD Standard
-
4.0
UFS Version
-
3x USB4 40Gbps, 2x USB 3.2 Gen2x1, 1x eUSB2
USB Interface Type
-
USB 4.0
USB Version
-
-
PCIe Lanes
28
Miscellaneous
Qualcomm Aqstic audio technology, Qualcomm aptX Audio
Audio Technology
-
Qualcomm Spectra ISP
Image Signal Processor
-
Qualcomm Secure Processing Unit with Microsoft Pluton TPM
Security Processor
-
Up to 36 MP
Single Camera Support
-
4K HDR video capture
Video Capture
-
Benchmarks
Cinebench R23 Single Core
Snapdragon X Plus X1P-42-100
1114
Core Ultra 5 225H
2055
+84%
Cinebench R23 Multi Core
Snapdragon X Plus X1P-42-100
7510
Core Ultra 5 225H
15719
+109%
Geekbench 6 Single Core
Snapdragon X Plus X1P-42-100
2408
Core Ultra 5 225H
2631
+9%
Geekbench 6 Multi Core
Snapdragon X Plus X1P-42-100
11303
Core Ultra 5 225H
13243
+17%
Passmark CPU Single Core
Snapdragon X Plus X1P-42-100
3236
Core Ultra 5 225H
4139
+28%
Passmark CPU Multi Core
Snapdragon X Plus X1P-42-100
17976
Core Ultra 5 225H
25717
+43%
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