Advantages
- More Total Cores: 12 (12 vs 2)
- Higher Technology: 4 nm (4 nm vs 14 nm)
- Newer PCI Express Version: 4.0 (4.0 vs 3.0)
- Higher Memory Type: LPDDR5x-8448 (LPDDR5x-8448 vs LPDDR3-1866 | DDR3L-1600)
- Newer Launch Date: October 2023 (October 2023 vs July 2018)
Basic
Qualcomm
Label Name
Intel
October 2023
Launch Date
July 2018
Laptop
Platform
Mobile
X1E-00-1DE
Model Name
i5-8200Y
Oryon
Code Name
Amber Lake Y
Samsung TSMC
Foundry
-
Oryon
Generation
-
CPU Specifications
12
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
2
12
Total Threads
4
12
Performance-cores
-
-
Basic Frequency
1.30 GHz
-
Max Turbo Frequency
3.90 GHz
3.8 GHz
Performance-core Base Frequency
-
4.3 GHz
Performance-core Max Turbo Frequency
-
42MB
L3 Cache
-
100MHz
Bus Frequency
-
-
CPU Socket
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FCBGA1515
No
Unlocked Multiplier
-
4 nm
Technology
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
14 nm
23-65 W
TDP
5 W
-
Max. Operating Temperature
Junction Temperature is the maximum temperature allowed at the processor die.
100°C
4.0
PCI Express Version
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
3.0
4.0
PCIe Version
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
-
Arm-64
Instruction Set
An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.
-
Memory Specifications
LPDDR5x-8448
Memory Type
LPDDR3-1866 | DDR3L-1600
64GB
Max Memory Size
Max memory size refers to the maximum memory capacity supported by the processor.
16 GB
8
Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
2
-
Bus Speed
4 GT/s
135 GB/s
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
-
No
ECC Memory Support
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
-
GPU Specifications
Qualcomm Adreno
GPU Name
-
-
Integrated Graphics Model
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
Intel® UHD Graphics 615
-
Graphics Frequency
950 MHz
4.6 TFLOPS
Graphics Performance
-
Benchmarks
Geekbench 6 Single Core
Snapdragon X Elite X1E-00-1DE
2841
+203%
Core i5-8200Y
938
Geekbench 6 Multi Core
Snapdragon X Elite X1E-00-1DE
15334
+837%
Core i5-8200Y
1637
Related CPU Comparisons
Share in social media
Or Link To Us
<a href="https://cputronic.com/cpu/compare/qualcomm-snapdragon-x-elite-x1e-00-1de-vs-intel-core-i5-8200y" target="_blank">Qualcomm Snapdragon X Elite X1E-00-1DE vs Intel Core i5-8200Y</a>