Home / CPU Comparison / Intel Xeon Gold 5412U or AMD EPYC 9454: What's better?

Intel Xeon Gold 5412U

vs

AMD EPYC 9454

CPU Comparison Result

Below are the results of a comparison of Intel Xeon Gold 5412U and AMD EPYC 9454 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Intel Xeon Gold 5412U

Newer Launch Date: January 2023 (January 2023 vs November 2022)

AMD EPYC 9454

More Total Cores: 48 (24 vs 48)
Larger L3 Cache: 256 MB (45MB vs 256 MB)

Basic

Intel

Label Name

AMD

January 2023

Launch Date

November 2022

Server

Platform

Server

Xeon Gold 5412U

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

EPYC 9454

Sapphire Rapids

Code Name

Intel

Foundry

Xeon Gold (Sapphire Rapids-SP)

Generation

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Basic Frequency

2.75 GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Up to 3.8 GHz

2.1 GHz

Performance-core Base Frequency

3.9 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

80K per core

L1 Cache

2MB per core

L2 Cache

45MB

L3 Cache

256 MB

100MHz

Bus Frequency

Intel Socket 4677

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

SP5

21.0

Multiplier

Unlocked Multiplier

10 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

185 W

TDP

290W

81 °C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 5.0 x128

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

Memory Specifications

DDR5-4400

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR5

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Bus Speed

Up to 4800 MT/s

Yes

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.