Advantages
- Larger L3 Cache: 20MB shared (20MB shared vs 16 MB)
- Higher Technology: TSMC 4nm FinFET (22 nm vs TSMC 4nm FinFET)
- Higher Memory Type: DDR5 (DDR3 vs DDR5)
- Newer Launch Date: April 2024 (September 2013 vs April 2024)
Basic
Intel
Label Name
AMD
September 2013
Launch Date
April 2024
Server
Platform
Desktop
Xeon E5-2650 v2
Model Name
Ryzen 7 8700F
Ivy Bridge-EP
Code Name
Phoenix
Intel
Foundry
-
Xeon E5 (Ivy Bridge-EP)
Generation
Zen 4
-
OS Support
Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit
CPU Specifications
8
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
8
16
Total Threads
16
-
Basic Frequency
4.1 GHz
-
Max Turbo Frequency
Up to 5 GHz
2.6 GHz
Performance-core Base Frequency
-
3.4 GHz
Performance-core Max Turbo Frequency
-
64K per core
L1 Cache
-
256K per core
L2 Cache
8 MB
20MB shared
L3 Cache
16 MB
100MHz
Bus Frequency
-
Intel Socket 2011
CPU Socket
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
AM5
26.0
Multiplier
-
-
Unlocked for Overclocking
Yes
No
Unlocked Multiplier
-
22 nm
Technology
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
TSMC 4nm FinFET
95 W
TDP
65W
-
Max. Operating Temperature
Junction Temperature is the maximum temperature allowed at the processor die.
95°C
-
PCI Express Version
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCIe® 4.0
3
PCIe Version
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
-
-
Instruction Set
An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.
x86-64
1.4 billions
Transistor Count
-
Memory Specifications
DDR3
Memory Type
DDR5
-
Max Memory Size
Max memory size refers to the maximum memory capacity supported by the processor.
256 GB
4
Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
2
-
Maximum Memory Speed
2x1R DDR5-5200, 2x2R DDR5-5200, 4x1R DDR5-3600, 4x2R DDR5-3600
Yes
ECC Memory Support
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
-
GPU Specifications
-
Integrated Graphics Model
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
Discrete Graphics Card Required
Miscellaneous
Benchmarks
Geekbench 6 Single Core
Xeon E5-2650 v2
512
Ryzen 7 8700F
2733
+434%
Geekbench 6 Multi Core
Xeon E5-2650 v2
4542
Ryzen 7 8700F
14546
+220%
Passmark CPU Single Core
Xeon E5-2650 v2
1685
Ryzen 7 8700F
3907
+132%
Passmark CPU Multi Core
Xeon E5-2650 v2
9915
Ryzen 7 8700F
31170
+214%
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