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Intel Xeon E3-1230 v2

vs

AMD FX-8350

CPU Comparison Result

Below are the results of a comparison of Intel Xeon E3-1230 v2 and AMD FX-8350 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Intel Xeon E3-1230 v2

Higher Technology: 22 nm (22 nm vs 32 nm)

AMD FX-8350

More Total Cores: 8 (4 vs 8)
Newer Launch Date: October 2012 (May 2012 vs October 2012)

Basic

Intel

Label Name

AMD

May 2012

Launch Date

October 2012

Server

Platform

Desktop

Xeon E3-1230 v2

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

FX-8350

Ivy Bridge

Code Name

Vishera

Intel

Foundry

Xeon E3 (Ivy Bridge)

Generation

FX (Vishera)

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Basic Frequency

4 GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

up to 4.2 GHz

3.3 GHz

Performance-core Base Frequency

3.7 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

64K per core

L1 Cache

384 KB

256K per core

L2 Cache

8 MB

8MB shared

L3 Cache

8 MB (shared)

100MHz

Bus Frequency

200 MHz

Intel Socket 1155

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

AMD Socket AM3+

33.0

Multiplier

20.0x

Multiplier Unlocked

Yes

Unlocked Multiplier

22 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

32 nm

69 W

TDP

125 W

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Gen 2

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

1.4 billions

Transistor Count

1,200 million

Memory Specifications

DDR3

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR3

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Dual-channel

ECC Memory

Yes

ECC Memory Support

GPU Specifications

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

On certain motherboards (Chipset feature)