Home / CPU Comparison / Intel Xeon 6507P or AMD EPYC 9015: What's better?

Intel Xeon 6507P

vs

AMD EPYC 9015

CPU Comparison Result

Below are the results of a comparison of Intel Xeon 6507P and AMD EPYC 9015 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Intel Xeon 6507P

Newer Launch Date: February 2025 (February 2025 vs October 2024)

AMD EPYC 9015

Larger L3 Cache: 64 MB (48 MB shared vs 64 MB)

Basic

Intel

Label Name

AMD

February 2025

Launch Date

October 2024

Server

Platform

Server

Xeon 6507P

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

EPYC 9015

Granite Rapids

Code Name

Intel

Foundry

Xeon 6 (Granite Rapids-SP)

Generation

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Basic Frequency

3.6 GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Up to 4.1 GHz

3.5 GHz

Performance-core Base Frequency

4.3 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

112 KB per core

L1 Cache

2 MB per core

L2 Cache

48 MB shared

L3 Cache

64 MB

100 MHz

Bus Frequency

Intel Socket 4710

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

SP5

35.0

Multiplier

Unlocked Multiplier

5 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

150 W

TDP

125W

103°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 5.0 x128

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

Memory Specifications

DDR5-6400

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR5

4 TB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Bus Speed

Up to 6400 MT/s

Yes

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.