Intel Core i9-12900TE
vs
Intel Xeon Gold 6416H

vs

CPU Comparison Result

Below are the results of a comparison of Intel Core i9-12900TE and Intel Xeon Gold 6416H processors based on key performance characteristics, as well as power consumption and much more.

Advantages

  • Higher Performance-core Max Turbo Frequency: 4.80 GHz (4.80 GHz vs 4.2 GHz)
  • Higher Technology: Intel 7 (Intel 7 vs 10 nm)
  • More Total Cores: 18 (16 vs 18)
  • Larger L3 Cache: 45MB (30 MB vs 45MB)
  • Newer Launch Date: January 2023 (January 2022 vs January 2023)

Basic

Intel
Label Name
Intel
January 2022
Launch Date
January 2023
Embedded
Platform
Server
i9-12900TE
Model Name
Xeon Gold 6416H
Alder Lake
Code Name
Sapphire Rapids
-
Foundry
Intel
-
Generation
Xeon Gold (Sapphire Rapids-SP)

CPU Specifications

16
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
18
24
Total Threads
36
8
Performance-cores
-
8
Efficient-cores
-
Yes
Intel Virtualization Technology (VT-x)
-
Yes
Intel Virtualization Technology for Directed I/O (VT-d)
-
4.80 GHz
Max Turbo Frequency
-
1.10 GHz
Performance-core Base Frequency
2.2 GHz
1.00 GHz
Efficient-core Base Frequency
-
3.60 GHz
Efficient-core Max Turbo Frequency
-
4.80 GHz
Performance-core Max Turbo Frequency
4.2 GHz
Yes
Enhanced Intel SpeedStep Technology
-
Yes
Intel Hyper-Threading Technology
-
No
Intel Turbo Boost Max Technology 3.0
-
2.0
Intel Turbo Boost Technology
-
4.80 GHz
Intel Turbo Boost Technology 2.0 Frequency
-
-
L1 Cache
80K per core
-
L2 Cache
2MB per core
30 MB
L3 Cache
45MB
-
Bus Frequency
100MHz
30 MB Intel® Smart Cache
Cache
-
FCLGA1700
CPU Socket
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
Intel Socket 4677
-
Multiplier
22.0
-
Unlocked Multiplier
No
Yes
Intel AES New Instructions
-
Intel 7
Technology
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
10 nm
35 W
TDP
165 W
35 W
Processor Base Power
-
100°C
Max. Operating Temperature
Junction Temperature is the maximum temperature allowed at the processor die.
82 °C
5.0 and 4.0
PCI Express Version
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
-
-
PCIe Version
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
5
20
Max Number of PCI Express Lanes
A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.
-
64-bit
Instruction Set
An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.
-
Yes
Intel 64
-
Yes
Intel VT-x with Extended Page Tables (EPT)
-
Up to 1x16+4 | 2x8+4
PCI Express Configurations
PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.
-

Memory Specifications

Up to DDR5 4800 MT/s Up to DDR4 3200 MT/s
Memory Type
DDR5-4800
128 GB
Max Memory Size
Max memory size refers to the maximum memory capacity supported by the processor.
4 TB
2
Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
8
76.8 GB/s
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
-
Yes
ECC Memory Support
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Yes

GPU Specifications

Intel® UHD Graphics 770
Integrated Graphics Model
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
-
300 MHz
Graphics Base Frequency
Graphics Base frequency refers to the rated/guaranteed graphics render clock frequency in MHz.
-
1.55 GHz
Graphics Frequency
-
12
DirectX Support
DirectX* Support indicates support for a specific version of Microsoft’s collection of APIs (Application Programming Interfaces) for handling multimedia compute tasks.
-
32
Execution Units
-
7680 x 4320 @ 60Hz
Max Resolution (DP)
Max Resolution (DP) is the maximum resolution supported by the processor via the DP interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.
-
5120 x 3200 @ 120Hz
Max Resolution (eDP - Integrated Flat Panel)
Max Resolution (Integrated Flat Panel) is the maximum resolution supported by the processor for a device with an integrated flat panel (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your device.
-
4096 x 2160 @ 60Hz
Max Resolution (HDMI)
Max Resolution (HDMI) is the maximum resolution supported by the processor via the HDMI interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.
-
4
Number of Displays Supported
-
eDP 1.4b | DP 1.4a | HDMI 2.1
Graphics Output
Graphics Output defines the interfaces available to communicate with display devices.
-
Yes
Intel Clear Video HD Technology
-
4.5
OpenGL Support
OpenGL (Open Graphics Library) is a cross-language, multi-platform API (Application Programming Interface) for rendering 2D and 3D vector graphics.
-
2.1
OpenCL Support
OpenCL (Open Computing Language) is a multi-platform API (Application Programming Interface) for heterogeneous parallel programming.
-
Yes
Intel Quick Sync Video
-

AI Specifications

3.0
Intel Gaussian Neural Accelerator
-
Yes
Intel Deep Learning Boost (Intel DL Boost) on CPU
-

Interfaces and Ports

Yes
Intel Volume Management Device (VMD)
-
-
PCIe Lanes
80

Miscellaneous

Intel® SSE4.1 | Intel® SSE4.2 | Intel® AVX2
Intel Standard Manageability (ISM)
-
Yes
Execute Disable Bit
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.
-
Yes
Intel Active Management Technology (AMT)
-
Yes
Intel Boot Guard
-
Yes
Intel Hardware Shield Eligibility
-
Yes
Intel Control-Flow Enforcement Technology
-
Yes
Intel OS Guard
-

Benchmarks

Geekbench 6 Single Core
Core i9-12900TE
1923 +49%
Xeon Gold 6416H
1289
Geekbench 6 Multi Core
Core i9-12900TE
11654 +8%
Xeon Gold 6416H
10815
Passmark CPU Single Core
Core i9-12900TE
3926 +37%
Xeon Gold 6416H
2860
Passmark CPU Multi Core
Core i9-12900TE
35057
Xeon Gold 6416H
40606 +16%