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Intel Core i7-11700K vs AMD Ryzen 5 4500

Intel Core i7-11700K

AMD Ryzen 5 4500

CPU Comparison Result

Below are the results of a comparison of Intel Core i7-11700K and AMD Ryzen 5 4500 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Intel Core i7-11700K

More Total Cores: 8 (8 vs 6)
Larger L3 Cache: 16MB shared (16MB shared vs 8MB)

AMD Ryzen 5 4500

Higher Technology: TSMC 7nm FinFET (14 nm vs TSMC 7nm FinFET)
Newer Launch Date: April 2022 (March 2021 vs April 2022)

Basic

Intel

Label Name

AMD

March 2021

Launch Date

April 2022

Desktop

Platform

Desktop

i7-11700K

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Rocket Lake

Code Name

Renoir

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Basic Frequency

3.6GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Up to 4.1GHz

3.6 GHz

Performance-core Base Frequency

5 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

64K per core

L1 Cache

384KB

512K per core

L2 Cache

3MB

16MB shared

L3 Cache

8MB

LGA-1200

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

AM4

Unlocked for Overclocking

AMD`s product warranty does not cover damages caused by overclocking, even when overclocking is enabled via AMD hardware and/or software. GD-26.

Yes

14 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 7nm FinFET

125 W

TDP

65W

100 °C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

95°C

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe 3.0

Memory Specifications

DDR4-3200

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR4

128GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Bus Speed

Up to 3200MT/s

GPU Specifications

True

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

Discrete Graphics Card Required

Miscellaneous

OS Support

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.