Home / CPU Comparison / Intel Celeron J4025 or AMD Ryzen Embedded R1600: What's better?

Intel Celeron J4025

vs

AMD Ryzen Embedded R1600

CPU Comparison Result

Below are the results of a comparison of Intel Celeron J4025 and AMD Ryzen Embedded R1600 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen Embedded R1600

Newer Launch Date: February 2020 (November 2019 vs February 2020)

Basic

Intel

Label Name

AMD

November 2019

Launch Date

February 2020

Desktop

Platform

Mobile

J4025

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Ryzen Embedded R1600

Gemini Lake Refresh

Code Name

Zen

Generation

Ryzen Embedded (Zen (Banded Kestrel))

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Basic Frequency

2.6 GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

up to 3.1 GHz

2.0 GHz

Performance-core Base Frequency

2.9 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

32K per core

L1 Cache

96 KB (per core)

4MB shared

L2 Cache

512 KB (per core)

L3 Cache

4 MB (shared)

Bus Frequency

100 MHz

BGA-1090

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

AMD Socket FP5

Multiplier

26.0x

Multiplier Unlocked

14 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

14 nm

10 W

TDP

25 W

105 °C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

105°C

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Gen 3, 8 Lanes (CPU only)

Transistor Count

4,950 million

Memory Specifications

DDR4-2400

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR4

8GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Dual-channel

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Yes

GPU Specifications

True

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.