Home / CPU Comparison / Apple M3 or Intel Core i5-14450HX: What's better?

Apple M3

vs

Intel Core i5-14450HX

CPU Comparison Result

Below are the results of a comparison of Apple M3 and Intel Core i5-14450HX processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Apple M3

Higher Technology: 3 nm (3 nm vs 10 nm)

Intel Core i5-14450HX

More Total Cores: 10 (8 vs 10)
Higher Performance-core Max Turbo Frequency: up to 4.8 GHz (4.06 GHz vs up to 4.8 GHz)
Newer Launch Date: January 2024 (October 2023 vs January 2024)

Basic

Apple

Label Name

Intel

October 2023

Launch Date

January 2024

Laptop

Platform

Mobile

Apple M3 performance cores + efficiency cores

CPU Architecture

Apple M3

CPU Name

Apple M3

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Core i5-14450HX

Code Name

Raptor Lake-HX

TSMC

Foundry

Apple M3 series

Generation

Core i5 (Raptor Lake-HX Refresh)

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Efficient-cores

Performance-core Base Frequency

2.4 GHz

Efficient-core Base Frequency

1800 MHz up to 3.5 GHz

2.75 GHz

Efficient-core Max Turbo Frequency

Maximum E-core turbo frequency derived from Intel® Turbo Boost Technology.

NEON

Instruction Set Extensions

4.06 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

up to 4.8 GHz

ARMv8.6-A, NEON

Extended Instruction Set

P-cores: 192 KB instruction + 128 KB data per core; E-cores: 128 KB instruction + 64 KB data per core

L1 Cache

80 KB (per core)

P-core cluster: 16 MB; E-core cluster: 4 MB

L2 Cache

2 MB (per core)

L3 Cache

20 MB (shared)

Bus Frequency

100 MHz

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

Intel BGA 1964

Multiplier

24.0x

Multiplier Unlocked

Yes

3 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

10 nm

TDP

55 W

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100°C

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Gen 5, 16 Lanes (CPU only)

ARMv8.6-A

Instruction Set

The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.

25 billion

Transistor Count

Memory Specifications

128-bit

Memory Bus Width

Unified LPDDR5-6400

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR4, DDR5

LPDDR5-6400

LPDDR5 Speed

24 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Dual-channel

100 GB/s

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

6400 MT/s

Maximum Memory Speed

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Yes

GPU Specifications

Thunderbolt 3 / USB4 with DisplayPort, HDMI

External Display Standard

Apple M3 GPU

GPU Name

Up to 6K 60Hz external display; up to 5K 60Hz second external display with lid closed; HDMI up to 4K 120Hz

Max External Display Resolution

Hardware-accelerated video encode/decode; AV1 decode

Video Concurrency

H.264, HEVC, ProRes, ProRes RAW, AV1 decode

Video Decode

H.264, HEVC, ProRes, ProRes RAW

Video Encode

Apple media engine with ProRes acceleration and AV1 decode

Video Processing Unit

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

Intel® UHD Graphics for 14th Gen Intel® Processors

1400 MHz

GPU Max Dynamic Frequency

Graphics Core Count

Up to 2 external displays with lid closed

Number of Displays Supported

Metal, OpenCL

GPU APIs

Up to 3.55 TFLOPS FP32

Graphics Performance

Hardware-accelerated H.264, HEVC, ProRes, ProRes RAW, and AV1 decode

Media Engine