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AMD Ryzen Threadripper 3970X

vs

AMD Ryzen Threadripper 2950X

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen Threadripper 3970X and AMD Ryzen Threadripper 2950X processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen Threadripper 3970X

More Total Cores: 32 (32 vs 16)
Higher Max Turbo Frequency: Up to 4.5GHz (Up to 4.5GHz vs Up to 4.4GHz)
Larger L3 Cache: 128MB (128MB vs 32MB)
Higher Technology: TSMC 7nm FinFET (TSMC 7nm FinFET vs 12nm)
Newer PCI Express Version: PCIe 4.0 (PCIe 4.0 vs PCIe 3.0)
Newer Launch Date: November 2019 (November 2019 vs August 2018)

Basic

AMD

Label Name

AMD

November 2019

Launch Date

August 2018

Desktop

Platform

Desktop

Castle Peak

Code Name

Colfax

Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.

OS Support

Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

3.7GHz

Basic Frequency

3.5GHz

Up to 4.5GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Up to 4.4GHz

2048KB

L1 Cache

1536KB

16MB

L2 Cache

8MB

128MB

L3 Cache

32MB

sTRX4

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

sTR4

Yes

Unlocked for Overclocking

AMD`s product warranty does not cover damages caused by overclocking, even when overclocking is enabled via AMD hardware and/or software. GD-26.

Yes

TSMC 7nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

12nm

280W

TDP

180W

95°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

68°C

PCIe 4.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe 3.0

Memory Specifications

DDR4

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR4

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Up to 3200MT/s

Bus Speed

Up to 2933MT/s

GPU Specifications

Discrete Graphics Card Required

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

Discrete Graphics Card Required