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AMD Ryzen Embedded R1305G

vs

AMD 3020e

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen Embedded R1305G and AMD 3020e processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen Embedded R1305G

Higher Max Turbo Frequency: up to 2.8 GHz (up to 2.8 GHz vs Up to 2.6GHz)
Newer PCI Express Version: Gen 3, 8 Lanes (CPU only) (Gen 3, 8 Lanes (CPU only) vs PCIe® 3.0)
Newer Launch Date: February 2020 (February 2020 vs January 2020)

Basic

AMD

Label Name

AMD

February 2020

Launch Date

January 2020

Mobile

Platform

Laptop

Ryzen Embedded R1305G

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Zen

Code Name

Ryzen Embedded (Zen (Banded Kestrel))

Generation

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

1500 MHz

Basic Frequency

1.2GHz

up to 2.8 GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Up to 2.6GHz

96 KB (per core)

L1 Cache

512 KB (per core)

L2 Cache

1MB

4 MB (shared)

L3 Cache

4MB

100 MHz

Bus Frequency

AMD Socket FP5

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

15.0x

Multiplier

Multiplier Unlocked

14 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

14nm

10 W

TDP

105°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

Gen 3, 8 Lanes (CPU only)

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 3.0

4,950 million

Transistor Count

Memory Specifications

DDR4

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR4

Dual-channel

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Bus Speed

Up to 2400MT/s

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Specifications

Radeon Vega 3

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ Graphics

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

1000 MHz