Home / CPU Comparison / AMD Ryzen AI 9 365 or AMD Ryzen 7 H 255: What's better?

AMD Ryzen AI 9 365

vs

AMD Ryzen 7 H 255

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen AI 9 365 and AMD Ryzen 7 H 255 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen AI 9 365

More Total Cores: 10 (10 vs 8)
Larger L3 Cache: 24 MB (24 MB vs 16 MB shared)
Newer Launch Date: July 2025 (July 2025 vs January 2025)

Basic

AMD

Label Name

AMD

July 2025

Launch Date

January 2025

Laptop

Platform

Laptop

Ryzen AI 9 365

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Ryzen 7 H 255

Strix Point

Code Name

Zen 4 (Hawk Point)

4x Zen 5, 6x Zen 5c

Generation

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

2 GHz

Basic Frequency

Up to 5 GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Performance-core Base Frequency

3.8 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

4.9 GHz

L1 Cache

64 K per core

10 MB

L2 Cache

1 MB per core

24 MB

L3 Cache

16 MB shared

FP8

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FP8

Unlocked Multiplier

Multiplier

Bus Frequency

100 MHz

TSMC 4nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

4 nm

28W

TDP

100°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100 °C

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

4.0

PCIe® 4.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Instruction Set

The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.

x86-64

Transistor Count

25 billions

Memory Specifications

DDR5 (FP8), LPDDR5X (FP8)

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

LPDDR5X-7500,DDR5-5600

256 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

256 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

2x2R DDR5-5600

Maximum Memory Speed

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

120 GB/s

ECC Memory Support

GPU Specifications

AMD Radeon™ 880M

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

true

2900 MHz

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

GPU Max Dynamic Frequency

2600 MHz

GPU Base Frequency

800 MHz

Graphics Core Count

Execution Units

The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.