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AMD Ryzen AI 7 350

vs

Intel Core Ultra 7 270HX Plus

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen AI 7 350 and Intel Core Ultra 7 270HX Plus processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Intel Core Ultra 7 270HX Plus

More Total Cores: 20 (8 vs 20)
Larger L3 Cache: 30 MB shared (16 MB vs 30 MB shared)
Higher Technology: 3 nm (TSMC 4nm FinFET vs 3 nm)
Newer Launch Date: March 2026 (February 2025 vs March 2026)

Basic

AMD

Label Name

Intel

February 2025

Launch Date

March 2026

Laptop

Platform

Laptop

Ryzen AI 7 350

Model Name

Core Ultra 7 270HX Plus

Krackan Point

Code Name

Arrow Lake-HX Refresh

Foundry

TSMC

4x Zen 5, 4x Zen 5c

Generation

Ultra 7 (Arrow Lake-HX)

Windows 11 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit

OS Support

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Performance-cores

Efficient-cores

2 GHz

Basic Frequency

Up to 5 GHz

Max Turbo Frequency

Performance-core Base Frequency

2.4 GHz

Efficient-core Base Frequency

1800 MHz

Performance-core Max Turbo Frequency

5.3 GHz

L1 Cache

192 KB per core

8 MB

L2 Cache

3 MB per core

16 MB

L3 Cache

30 MB shared

Bus Frequency

100 MHz

FP8

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

Intel BGA 2114

Multiplier

24.0

Unlocked Multiplier

Yes

TSMC 4nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

3 nm

28W

TDP

55 W

100°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

105°C

PCIe® 4.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

Transistor Count

17.8 billions

Memory Specifications

DDR5 (FP8), LPDDR5X (FP8)

Memory Type

DDR5-6400

256 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

4x2R LPDDR5x-8000, DDR5-5600

Maximum Memory Speed

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Specifications

AMD Radeon™ 860M

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

Intel® Graphics

Graphics Core Count

3000 MHz

Graphics Frequency