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AMD Ryzen AI 7 350

vs

AMD Ryzen 7 7800X3D

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen AI 7 350 and AMD Ryzen 7 7800X3D processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen AI 7 350

Higher Technology: TSMC 4nm FinFET (TSMC 4nm FinFET vs TSMC 5nm FinFET)
Newer Launch Date: February 2025 (February 2025 vs April 2023)

AMD Ryzen 7 7800X3D

Larger L3 Cache: 96 MB (16 MB vs 96 MB)
Newer PCI Express Version: PCIe® 5.0 (PCIe® 4.0 vs PCIe® 5.0)

Basic

AMD

Label Name

AMD

February 2025

Launch Date

April 2023

Laptop

Platform

Desktop

Ryzen AI 7 350

Model Name

Ryzen 7 7800X3D

Krackan Point

Code Name

Raphael AM5

4x Zen 5, 4x Zen 5c

Generation

Zen 4

Windows 11 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit

OS Support

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

2 GHz

Basic Frequency

4.2 GHz

Up to 5 GHz

Max Turbo Frequency

Up to 5 GHz

L1 Cache

512 KB

8 MB

L2 Cache

8 MB

16 MB

L3 Cache

96 MB

FP8

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

AM5

TSMC 4nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 5nm FinFET

28W

TDP

120W

100°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

89°C

PCIe® 4.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 5.0

Instruction Set

An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.

x86-64

Memory Specifications

DDR5 (FP8), LPDDR5X (FP8)

Memory Type

DDR5

256 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

128 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

4x2R LPDDR5x-8000, DDR5-5600

Maximum Memory Speed

2x1R DDR5-5200, 2x2R DDR5-5200, 4x1R DDR5-3600, 4x2R DDR5-3600

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Yes (Requires mobo support)

GPU Specifications

AMD Radeon™ 860M

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ Graphics

Graphics Core Count

3000 MHz

Graphics Frequency

2200 MHz