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AMD Ryzen 9 PRO 7940HS

vs

AMD Ryzen 7 4800H

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 9 PRO 7940HS and AMD Ryzen 7 4800H processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen 9 PRO 7940HS

Higher Max Turbo Frequency: Up to 5.2GHz (Up to 5.2GHz vs Up to 4.2GHz)
Larger L3 Cache: 16MB (16MB vs 8MB)
Higher Technology: TSMC 4nm FinFET (TSMC 4nm FinFET vs TSMC 7nm FinFET)
Newer PCI Express Version: PCIe® 4.0 (PCIe® 4.0 vs PCIe® 3.0)
Higher Memory Type: DDR5 (FP7r2), LPDDR5/x (FP7) (DDR5 (FP7r2), LPDDR5/x (FP7) vs DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s)
Newer Launch Date: June 2023 (June 2023 vs January 2020)

Basic

AMD

Label Name

AMD

June 2023

Launch Date

January 2020

Laptop

Platform

Laptop

Code Name

Renoir

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.

OS Support

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

4.0GHz

Basic Frequency

2.9GHz

Up to 5.2GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Up to 4.2GHz

8MB

L2 Cache

4MB

16MB

L3 Cache

8MB

FP7, FP7r2

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FP6

Unlocked for Overclocking

AMD`s product warranty does not cover damages caused by overclocking, even when overclocking is enabled via AMD hardware and/or software. GD-26.

TSMC 4nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 7nm FinFET

TDP

45W

100°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

105°C

PCIe® 4.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 3.0

Memory Specifications

DDR5 (FP7r2), LPDDR5/x (FP7)

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

GPU Specifications

AMD Radeon™ 780M

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ Graphics

Graphics Core Count

2800 MHz

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

1600 MHz