AMD Ryzen 9 9955HX3D
vs
Intel Core i9-12900KS

vs

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 9 9955HX3D and Intel Core i9-12900KS processors based on key performance characteristics, as well as power consumption and much more.

Advantages

  • Larger L3 Cache: 128 MB (128 MB vs 30 MB)
  • Higher Technology: TSMC 4nm FinFET (TSMC 4nm FinFET vs Intel 7)
  • Newer Launch Date: January 2025 (January 2025 vs April 2022)
  • Higher Max Turbo Frequency: 5.50 GHz (Up to 5.4 GHz vs 5.50 GHz)
  • Newer PCI Express Version: 5.0 and 4.0 (PCIe® 5.0 vs 5.0 and 4.0)

Basic

AMD
Label Name
Intel
January 2025
Launch Date
April 2022
Laptop
Platform
Desktop
Ryzen 9 9955HX3D
Model Name
i9-12900KS
Fire Range
Code Name
Alder Lake
Zen 5
Generation
-
Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit
OS Support
-

CPU Specifications

16
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
16
32
Total Threads
24
-
Performance-cores
8
-
Efficient-cores
8
2.5 GHz
Basic Frequency
-
-
Intel Virtualization Technology (VT-x)
Yes
-
Intel Virtualization Technology for Directed I/O (VT-d)
Yes
Up to 5.4 GHz
Max Turbo Frequency
5.50 GHz
-
Performance-core Base Frequency
3.40 GHz
-
Efficient-core Base Frequency
2.50 GHz
-
Efficient-core Max Turbo Frequency
4.00 GHz
-
Performance-core Max Turbo Frequency
5.20 GHz
-
Enhanced Intel SpeedStep Technology
Yes
-
Intel Hyper-Threading Technology
Yes
-
Intel Turbo Boost Max Technology 3.0
Yes
-
Intel Turbo Boost Max Technology 3.0 Frequency
5.30 GHz
-
Intel Turbo Boost Technology
2.0
1280 KB
L1 Cache
-
16 MB
L2 Cache
-
128 MB
L3 Cache
30 MB
-
Cache
30 MB Intel® Smart Cache
FL1
CPU Socket
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FCLGA1700
Yes
Unlocked for Overclocking
-
-
Intel AES New Instructions
Yes
TSMC 4nm FinFET
Technology
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Intel 7
55W
TDP
150 W
-
Processor Base Power
150 W
-
Maximum Turbo Power
241 W
100°C
Max. Operating Temperature
Junction Temperature is the maximum temperature allowed at the processor die.
90°C
PCIe® 5.0
PCI Express Version
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
5.0 and 4.0
-
Max Number of PCI Express Lanes
A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.
20
x86-64
Instruction Set
An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.
64-bit
-
Intel 64
Yes
-
Intel VT-x with Extended Page Tables (EPT)
Yes
-
PCI Express Configurations
PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.
Up to 1x16+4 | 2x8+4

Memory Specifications

DDR5
Memory Type
Up to DDR5 4800 MT/s Up to DDR4 3200 MT/s
96 GB
Max Memory Size
Max memory size refers to the maximum memory capacity supported by the processor.
128 GB
2
Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
2
-
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
76.8 GB/s
2x1R DDR5-5600, 2x2R DDR5-5600
Maximum Memory Speed
-
-
ECC Memory Support
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Yes

GPU Specifications

AMD Radeon™ 610M
Integrated Graphics Model
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
Intel® UHD Graphics 770
-
Graphics Base Frequency
Graphics Base frequency refers to the rated/guaranteed graphics render clock frequency in MHz.
300 MHz
2
Graphics Core Count
-
2200 MHz
Graphics Frequency
1.55 GHz
-
DirectX Support
DirectX* Support indicates support for a specific version of Microsoft’s collection of APIs (Application Programming Interfaces) for handling multimedia compute tasks.
12
-
Execution Units
32
-
Max Resolution (DP)
Max Resolution (DP) is the maximum resolution supported by the processor via the DP interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.
7680 x 4320 @ 60Hz
-
Max Resolution (eDP - Integrated Flat Panel)
Max Resolution (Integrated Flat Panel) is the maximum resolution supported by the processor for a device with an integrated flat panel (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your device.
5120 x 3200 @ 120Hz
-
Max Resolution (HDMI)
Max Resolution (HDMI) is the maximum resolution supported by the processor via the HDMI interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.
4096 x 2160 @ 60Hz
-
Number of Displays Supported
4
-
Graphics Output
Graphics Output defines the interfaces available to communicate with display devices.
eDP 1.4b | DP 1.4a | HDMI 2.1
-
Intel Clear Video HD Technology
Yes
-
OpenGL Support
OpenGL (Open Graphics Library) is a cross-language, multi-platform API (Application Programming Interface) for rendering 2D and 3D vector graphics.
4.5
-
OpenCL Support
OpenCL (Open Computing Language) is a multi-platform API (Application Programming Interface) for heterogeneous parallel programming.
3.0
-
Intel Quick Sync Video
Yes

AI Specifications

-
Intel Gaussian Neural Accelerator
3.0
-
Intel Deep Learning Boost (Intel DL Boost) on CPU
Yes

Interfaces and Ports

-
Intel Volume Management Device (VMD)
Yes

Miscellaneous

Official Website
-
-
Intel Standard Manageability (ISM)
Intel® SSE4.1 | Intel® SSE4.2 | Intel® AVX2
-
Execute Disable Bit
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.
Yes
-
Intel Active Management Technology (AMT)
Yes
-
Intel Boot Guard
Yes
-
Intel Hardware Shield Eligibility
Yes
-
Intel Control-Flow Enforcement Technology
Yes
-
Intel OS Guard
Yes

Benchmarks

Geekbench 6 Single Core
Ryzen 9 9955HX3D
3180 +18%
Core i9-12900KS
2697
Geekbench 6 Multi Core
Ryzen 9 9955HX3D
18788 +15%
Core i9-12900KS
16271
Geekbench 7 Single Core
Ryzen 9 9955HX3D
3038 +21%
Core i9-12900KS
2517
Geekbench 7 Multi Core
Ryzen 9 9955HX3D
26465 +51%
Core i9-12900KS
17523
Passmark CPU Single Core
Ryzen 9 9955HX3D
4622 +6%
Core i9-12900KS
4354
Passmark CPU Multi Core
Ryzen 9 9955HX3D
67091 +52%
Core i9-12900KS
44157
3DMark CPU Profile Single Core
Ryzen 9 9955HX3D
1245 +10%
Core i9-12900KS
1131
3DMark CPU Profile Multi Core
Ryzen 9 9955HX3D
15736 +32%
Core i9-12900KS
11922