Home / CPU Comparison / AMD Ryzen 9 9900X3D or Intel Core i7-4770K: What's better?

AMD Ryzen 9 9900X3D

vs

Intel Core i7-4770K

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 9 9900X3D and Intel Core i7-4770K processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen 9 9900X3D

More Total Cores: 12 (12 vs 4)
Higher Max Turbo Frequency: Up to 5.5 GHz (Up to 5.5 GHz vs up to 3.9 GHz)
Larger L3 Cache: 128 MB (128 MB vs 8 MB (shared))
Higher Technology: TSMC 4nm FinFET (TSMC 4nm FinFET vs 22 nm)
Higher Memory Type: DDR5 (DDR5 vs DDR3)
Newer Launch Date: March 2025 (March 2025 vs June 2013)

Intel Core i7-4770K

Newer PCI Express Version: Gen 3, 16 Lanes (CPU only) (PCIe® 5.0 vs Gen 3, 16 Lanes (CPU only))

Basic

AMD

Label Name

Intel

March 2025

Launch Date

June 2013

Desktop

Platform

Desktop

Ryzen 9 9900X3D

Model Name

Core i7-4770K

Granite Ridge AM5

Code Name

Haswell

Zen 5

Generation

Core i7 (Haswell)

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit

OS Support

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

4.4 GHz

Basic Frequency

3.5 GHz

Up to 5.5 GHz

Max Turbo Frequency

up to 3.9 GHz

960 KB

L1 Cache

64 KB (per core)

12 MB

L2 Cache

256 KB (per core)

128 MB

L3 Cache

8 MB (shared)

Bus Frequency

100 MHz

AM5

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

Intel Socket 1150

Multiplier

35.0x

Multiplier Unlocked

Yes

Unlocked for Overclocking

TSMC 4nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

22 nm

120W

TDP

84 W

95°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

PCIe® 5.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Gen 3, 16 Lanes (CPU only)

x86-64

Instruction Set

An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.

Transistor Count

1,400 million

Memory Specifications

DDR5

Memory Type

DDR3

256 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Dual-channel

2x1R DDR5-5600, 2x2R DDR5-5600, 4x1R DDR5-3600, 4x2R DDR5-3600

Maximum Memory Speed

Yes (Requires mobo support)

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Specifications

AMD Radeon™ Graphics

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

Intel HD 4600

Graphics Core Count

2200 MHz

Graphics Frequency