Home / CPU Comparison / AMD Ryzen 7 8745HX or Intel Core i7-14650HX: What's better?

AMD Ryzen 7 8745HX

vs

Intel Core i7-14650HX

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 7 8745HX and Intel Core i7-14650HX processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen 7 8745HX

Larger L3 Cache: 32 MB (32 MB vs 30 MB (shared))
Higher Technology: TSMC 5nm FinFET (TSMC 5nm FinFET vs 10 nm)
Newer Launch Date: April 2025 (April 2025 vs January 2024)

Intel Core i7-14650HX

More Total Cores: 16 (8 vs 16)
Newer PCI Express Version: Gen 5, 16 Lanes (CPU only) (PCIe® 5.0 vs Gen 5, 16 Lanes (CPU only))

Basic

AMD

Label Name

Intel

April 2025

Launch Date

January 2024

Laptop

Platform

Mobile

Ryzen 7 8745HX

Model Name

Core i7-14650HX

Dragon Range

Code Name

Raptor Lake-HX

Zen 4

Generation

Core i7 (Raptor Lake-HX Refresh)

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit

OS Support

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Performance-cores

Efficient-cores

3.6 GHz

Basic Frequency

Up to 5.1 GHz

Max Turbo Frequency

Performance-core Base Frequency

2.2 GHz

Efficient-core Base Frequency

1600 MHz up to 3.7 GHz

Performance-core Max Turbo Frequency

up to 5.2 GHz

512 KB

L1 Cache

80 KB (per core)

8 MB

L2 Cache

2 MB (per core)

32 MB

L3 Cache

30 MB (shared)

Bus Frequency

100 MHz

FL1

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

Intel BGA 1964

Multiplier

22.0x

Multiplier Unlocked

Yes

Unlocked for Overclocking

TSMC 5nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

10 nm

55W

TDP

55 W

100°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100°C

PCIe® 5.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Gen 5, 16 Lanes (CPU only)

x86-64

Instruction Set

An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.

Memory Specifications

DDR5

Memory Type

DDR4, DDR5

64 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Dual-channel

2x1R DDR5-5200, 2x2R DDR5-5200

Maximum Memory Speed

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Yes

GPU Specifications

AMD Radeon™ 610M

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

Intel® UHD Graphics for 14th Gen Intel® Processors

Graphics Core Count

2200 MHz

Graphics Frequency