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AMD Ryzen 7 7840H vs Intel Core Ultra 9 185H

AMD Ryzen 7 7840H

Intel Core Ultra 9 185H

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 7 7840H and Intel Core Ultra 9 185H processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen 7 7840H

Higher Technology: 4 nm (4 nm vs 7 nm)

Intel Core Ultra 9 185H

More Total Cores: 16 (8 vs 16)
Larger L3 Cache: 24 MB (16MB shared vs 24 MB)
Newer Launch Date: December 2023 (January 2023 vs December 2023)

Basic

AMD

Label Name

Intel

January 2023

Launch Date

December 2023

Laptop

Platform

Laptop

Ryzen 7 7840H

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Core Ultra 9 185H

Phoenix

Code Name

Meteor Lake

TSMC

Foundry

Ryzen 7 (Zen 4 (Phoenix))

Generation

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Efficient-cores

3.8 GHz

Performance-core Base Frequency

3.9 GHz

Efficient-core Base Frequency

1900 MHz

5.1 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

5.1 GHz

64K per core

L1 Cache

112 KB per core

1MB per core

L2 Cache

2 MB per core

16MB shared

L3 Cache

24 MB

AMD Socket FP8

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

Intel BGA 2049

Unlocked Multiplier

38.0

Multiplier

100MHz

Bus Frequency

4 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

7 nm

35 W

TDP

45 W

100 °C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

25 billions

Transistor Count

Memory Specifications

DDR5-5600

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR5-5600,LPDDR5x-7467

256GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

96GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

89.6 GB/s

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

Yes

ECC Memory Support

GPU Specifications

True

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

Xe Graphics LPG 128EU

2700 MHz

GPU Max Dynamic Frequency

Execution Units

The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.

10 TFLOPS

Graphics Performance