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AMD Ryzen 7 7735H vs AMD Ryzen 9 7940H

AMD Ryzen 7 7735H

AMD Ryzen 9 7940H

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 7 7735H and AMD Ryzen 9 7940H processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen 7 7735H

Newer Launch Date: January 2023 (January 2023 vs January 2023)

AMD Ryzen 9 7940H

Higher Max Turbo Frequency: up to 5.2 GHz (up to 4.75 GHz vs up to 5.2 GHz)
Higher Technology: 4 nm (6 nm vs 4 nm)

Basic

AMD

Label Name

AMD

January 2023

Launch Date

January 2023

Mobile

Platform

Mobile

Ryzen 7 7735H

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Ryzen 9 7940H

Rembrandt-R

Code Name

Phoenix

Ryzen 7 (Zen 3+ (Rembrandt))

Generation

Ryzen 9 (Zen 4 (Phoenix))

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

3.2 GHz

Basic Frequency

4 GHz

up to 4.75 GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

up to 5.2 GHz

64 KB (per core)

L1 Cache

64 KB (per core)

512 KB (per core)

L2 Cache

1 MB (per core)

16 MB (shared)

L3 Cache

16 MB (shared)

AMD Socket FP7

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

AMD Socket FP8

Multiplier Unlocked

100 MHz

Bus Frequency

100 MHz

32.0x

Multiplier

40.0x

6 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

4 nm

35 W

TDP

35 W

95°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100°C

Gen 4, 20 Lanes (CPU only)

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Gen 4, 20 Lanes (CPU only)

Transistors

25,000 million

Memory Specifications

DDR5

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR5

6400 MT/s

LPDDR5 Speed

Dual-channel

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Dual-channel

Yes

ECC Memory

Yes

GPU Specifications

Radeon 680M

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

Radeon 780M