Home / CPU Comparison / AMD Ryzen 7 3700X or AMD Ryzen 5 8500G: What's better?

AMD Ryzen 7 3700X

vs

AMD Ryzen 5 8500G

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 7 3700X and AMD Ryzen 5 8500G processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen 7 3700X

More Total Cores: 8 (8 vs 6)
Larger L3 Cache: 32MB (32MB vs 16 MB)
Newer PCI Express Version: PCIe 4.0 x16 (PCIe 4.0 x16 vs PCIe® 4.0)

AMD Ryzen 5 8500G

Higher Max Turbo Frequency: Up to 5 GHz (Up to 4.4GHz vs Up to 5 GHz)
Higher Technology: TSMC 4nm FinFET (TSMC 7nm FinFET vs TSMC 4nm FinFET)
Higher Memory Type: DDR5 (DDR4 vs DDR5)
Newer Launch Date: January 2024 (July 2019 vs January 2024)

Basic

AMD

Label Name

AMD

July 2019

Launch Date

January 2024

Desktop

Platform

Desktop

Model Name

Ryzen 5 8500G

Matisse

Code Name

Phoenix

Generation

2x Zen 4, 4x Zen 4c

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.

OS Support

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

3.6GHz

Basic Frequency

3.5 GHz

Up to 4.4GHz

Max Turbo Frequency

Up to 5 GHz

512KB

L1 Cache

4MB

L2 Cache

6 MB

32MB

L3 Cache

16 MB

AM4

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

AM5

Yes

Unlocked for Overclocking

TSMC 7nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 4nm FinFET

65W

TDP

65W

95°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

95°C

PCIe 4.0 x16

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 4.0

Instruction Set

An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.

x86-64

Memory Specifications

DDR4

Memory Type

DDR5

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

256 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Up to 3200MT/s

Bus Speed

Maximum Memory Speed

2x1R DDR5-5200, 2x2R DDR5-5200, 4x1R DDR5-3600, 4x2R DDR5-3600

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Yes (Requires platform support)

GPU Specifications

Discrete Graphics Card Required

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ 740M

Graphics Core Count

Graphics Frequency

2800 MHz