Home / CPU Comparison / AMD Ryzen 5 7535HS or Apple M3: What's better?

AMD Ryzen 5 7535HS

vs

Apple M3

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 5 7535HS and Apple M3 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Apple M3

More Total Cores: 8 (6 vs 8)
Higher Technology: 3 nm (TSMC 6nm FinFET vs 3 nm)
Newer Launch Date: October 2023 (April 2023 vs October 2023)

Basic

AMD

Label Name

Apple

April 2023

Launch Date

October 2023

Laptop

Platform

Laptop

CPU Architecture

Apple M3 performance cores + efficiency cores

CPU Name

Apple M3

Ryzen 5 7535HS

Model Name

Apple M3

Rembrandt R

Code Name

Foundry

TSMC

Zen 3+

Generation

Apple M3 series

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit

OS Support

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Performance-cores

Efficient-cores

3.3 GHz

Basic Frequency

Up to 4.55 GHz

Max Turbo Frequency

Efficient-core Max Turbo Frequency

2.75 GHz

Instruction Set Extensions

NEON

Performance-core Max Turbo Frequency

4.06 GHz

Extended Instruction Set

ARMv8.6-A, NEON

512 KB

L1 Cache

P-cores: 192 KB instruction + 128 KB data per core; E-cores: 128 KB instruction + 64 KB data per core

3 MB

L2 Cache

P-core cluster: 16 MB; E-core cluster: 4 MB

16 MB

L3 Cache

FP7

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

Unlocked for Overclocking

TSMC 6nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

3 nm

35-54W

TDP

95°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

PCIe® 4.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

x86-64

Instruction Set

An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.

ARMv8.6-A

Transistor Count

25 billion

Memory Specifications

Memory Bus Width

128-bit

DDR5, LPDDR5

Memory Type

Unified LPDDR5-6400

LPDDR5 Speed

LPDDR5-6400

64 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

24 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

100 GB/s

4x1R DDR5-4800

Maximum Memory Speed

6400 MT/s

Yes (Requires platform support)

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Specifications

External Display Standard

Thunderbolt 3 / USB4 with DisplayPort, HDMI

GPU Name

Apple M3 GPU

Max External Display Resolution

Up to 6K 60Hz external display; up to 5K 60Hz second external display with lid closed; HDMI up to 4K 120Hz

Video Concurrency

Hardware-accelerated video encode/decode; AV1 decode

Video Decode

H.264, HEVC, ProRes, ProRes RAW, AV1 decode

Video Encode

H.264, HEVC, ProRes, ProRes RAW

Video Processing Unit

Apple media engine with ProRes acceleration and AV1 decode

AMD Radeon™ 660M

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

GPU Max Dynamic Frequency

1400 MHz

Graphics Core Count

8/9/10

1900 MHz

Graphics Frequency

Number of Displays Supported

Up to 2 external displays with lid closed

GPU APIs

Metal, OpenCL

Graphics Performance

Up to 3.55 TFLOPS FP32